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Powder dispersion method for magnetron sputtering coating

A magnetron sputtering coating and magnetron sputtering technology, applied in the field of powder dispersion, can solve the problems of small particle size, large specific surface area and large surface energy of powder materials, and achieve uniform coating, uniform dense film, The effect of reducing the surface energy

Inactive Publication Date: 2018-04-24
SHANGHAI LANGYI NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Since the powder material has the characteristics of small particle size, large specific surface area, and large surface energy, and in the magnetron sputtering coating, the surface energy will increase with the coating of the metal / metal oxide film layer, and the powder has great Strong agglomeration tendency to reduce the surface energy of the system, so a core pain point in powder magnetron sputtering coating is the agglomeration of powder. At present, the most mainstream method is to use mechanical vibration to suppress powder agglomeration, but as The increase of the coating time and the thickening of the coating layer on the surface of the powder, the effect of mechanical vibration to suppress the agglomeration of the powder will drop sharply

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Take 500g of 100-150μm glass flakes and mix them with 25g of 1mm-2mm quartz sand evenly, put them into the storage bin of the magnetron sputtering coating machine, and assemble a cylindrical aluminum target on the magnetron sputtering target. Close the door of the vacuum chamber, turn on the vacuum pumping system, and evacuate to 4.3×10 -3 Pa, 50sccm of argon gas with a purity of 99.999% is introduced, and the vacuum degree of the cavity is controlled at 1.5×10 -1 Pa, turn on the vibration motor, turn on the magnetron sputtering power supply, and perform magnetron sputtering aluminum plating on the mixed powder. After the sputtering is completed, turn off the sputtering power supply and vacuum system, open the chamber to the atmosphere, open the chamber door, take out the mixed powder, and sieve out the quartz sand to obtain aluminized artificial glass.

Embodiment 2

[0024] Take 400g of 50-75μm aluminum oxide powder and 45g of 500μm-1000μm solid glass beads and mix evenly, add it to the storage bin of the magnetron sputtering coating machine, and assemble the sheet-shaped copper target on the magnetron sputtering target. Close the door of the vacuum chamber, turn on the vacuum pumping system, and evacuate to 4.3×10 -3 Pa, 50sccm of argon gas with a purity of 99.999% is introduced, and the vacuum degree of the cavity is controlled at 1.5×10 -1 Pa, turn on the ultrasonic vibration, turn on the magnetron sputtering power supply, and perform magnetron sputtering copper plating on the mixed powder. After the sputtering is completed, turn off the sputtering power supply and vacuum system, open the chamber to the atmosphere, open the chamber door, take out the mixed powder, and sieve out the solid glass beads to obtain copper-plated aluminum oxide.

Embodiment 3

[0026] Take 300g of 20-40μm quartz sand and 50g of 250μm-800μm calcite, mix evenly, add it to the storage bin of the magnetron sputtering coating machine, and assemble a cylindrical titanium target on the magnetron sputtering target. Close the door of the vacuum chamber, turn on the vacuum pumping system, and evacuate to 4.3×10 -3 Pa, 50sccm of argon gas with a purity of 99.999% is introduced, and the vacuum degree of the cavity is controlled at 1.5×10 -1 Pa, turn on the vibration motor, turn on the magnetron sputtering power supply, and perform magnetron sputtering titanium plating on the mixed powder. After the sputtering is completed, turn off the sputtering power supply and vacuum system, open the chamber to the atmosphere, open the chamber door, take out the mixed powder, and sieve out the calcite to obtain titanium-coated quartz sand.

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Abstract

The invention relates to a powder dispersion method for magnetron sputtering coating. The powder dispersion method comprises the step that a certain ratio of large particle powder with a large particle size and a small specific surface area is incorporated into a powder base material with the small particle size and the large specific surface area for magnetron sputtering coating. Under the traditional mechanical vibration dispersion conditions, the powder dispersion method can effectively reduce surface energy of an entire system, reduce an agglomeration tendency of the powder base material,and can improve the dispersion effect of the powder base material through the impact of the large particle powder and the agglomerate powder base material, thereby achieving the uniform coating. Afterthe coating is completed, the large particle powder is removed by screening to obtain a coated product. The particle size of the powder base material is 0.1-150[mu]m, the particle size of the large particle powder is 200[mu]m-2mm, and a mass ratio of the powder base material to the large particle powder is (5-20):1.

Description

Technical field: [0001] The invention relates to a powder dispersing method, in particular to a powder dispersing method for magnetron sputtering coating. Background technique: [0002] Magnetron sputtering is a type of physical vapor deposition (Physical Vapor Deposition, PVD). The general sputtering method can be used to prepare various materials such as metals, semiconductors, and insulators, and has the advantages of simple equipment, easy control, large coating area and strong adhesion, while the magnetron sputtering method developed in the 1970s It has achieved high speed, low temperature and low damage. Because high-speed sputtering is performed under low pressure, the ionization rate of the gas must be effectively increased. Magnetron sputtering introduces a magnetic field on the surface of the target cathode, and uses the magnetic field to confine charged particles to increase the plasma density to increase the sputtering rate. Due to the low energy of electrons ...

Claims

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Application Information

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IPC IPC(8): C23C14/35
CPCC23C14/223C23C14/35
Inventor 唐晓峰李大铭董建廷逯琪张文彬雷芝红
Owner SHANGHAI LANGYI NEW MATERIAL TECH CO LTD
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