A new type of stripping solution for copper process in panel industry

Abstract

The invention relates to a high-recycling rate and environmental-friendly stripping liquid for copper processing of TFT industry. The high-recycling rate and environmental-friendly stripping liquid comprises the following constituents based on percent by mass: 1-2% of alcohol, 40-50% of ether, 3-8% of mixed amine, 40-50% of organic solvent with a low boiling point, 1-5% of corrosion inhibitor and1-5% of non-ionic surfactant with the balancing being pure water. The stripping liquid is moderate in striping speed, no photoresist is resided on a surface of a stripped wafer under a 1,000-rate microscope, and no corrosion to a copper metal layer is generated. The photoresist removal capability is improved by using the alcohol and ether in a mixed way, and the corrosion-resistant performance ofcopper metal is improved by combining the mixed amine; while the corrosion of the copper metal can be improved when the dosage of a conventional amine substance is increased; in the stripping liquid,the mixed amine substance is used, namely, (hydrochloric acid mixed amine and monohydrate mixed amine) are used in a combination and are combined with other amine substances, thus, the photoresist removal capability can be improved, and the protection of the copper metal is improved; and moreover, since the mixed amine composition is very easy to dissolve in water and is convenient to remove, theaddition of an imidazole substance can be reduced, and a relatively small amount of additive is resided.

Description

technical field [0001] The invention relates to the technical field of electronic chemicals in the liquid crystal display thin film transistor (TFT) industry, in particular to a new type of stripping liquid used in the copper manufacturing process of the panel industry. Background technique [0002] In the manufacturing process of liquid crystal panels, etc., it is necessary to form multi-layer precise microcircuits on silicon wafers or glass substrates through multiple processes such as pattern mask exposure and etching. The photoresist covering the protected areas of the microcircuit as a mask is removed. The stripping process is to spray the stripping solution on the surface of the etched product, and the stripping solution will dissolve the photoresist that has not been irradiated by ultraviolet rays, leaving the protected part to form the circuit. [0003] In the process of stripping and removing the photoresist, the main problems that need to be solved are: the oxidat...

AI Technical Summary

Problems solved by technology

The conventional practice in the prior art is to add an azole protective agent, such as tolyltriazole, to protect the copper substrate, but the introduced azole protective agent will produce additive residues, which cannot be removed cleanly. There will be adverse effects such as increased surface current, and the development of a new type of stripping solution suitable for the copper process of the panel industry has become the research method of this application.

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