Forming method of semiconductor device
A semiconductor and device technology, applied in the field of semiconductor device formation, can solve problems such as the need to improve electrical performance
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[0023] As mentioned in the background, the performance of semiconductor devices formed in the prior art needs to be improved.
[0024] A method for forming a semiconductor device, comprising: providing a semiconductor substrate, the semiconductor substrate having a fin and an isolation structure covering part of the sidewall of the fin; forming a dummy gate across the fin on the isolation structure structure, the dummy gate structure includes a dummy gate dielectric layer and a dummy gate electrode layer, the dummy gate dielectric layer covers part of the top surface and sidewall surface of the fin, and the dummy gate electrode layer is located between the dummy gate dielectric layer and part of the On the isolation structure; forming an interlayer dielectric layer covering the sidewall of the dummy gate structure on the isolation structure; after forming the interlayer dielectric layer, removing the dummy gate electrode layer; after removing the dummy gate electrode layer, etc...
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