Light emitting diode epitaxial wafer and preparation method thereof
A technology of light-emitting diodes and manufacturing methods, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of limited promotion effect, achieve the effect of increasing the number of holes, improving luminous efficiency, and ensuring the confinement effect
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Embodiment 1
[0032] An embodiment of the present invention provides a light emitting diode epitaxial wafer, see figure 1 , the light-emitting diode epitaxial wafer includes a substrate 1 and a buffer layer 2, an undoped gallium nitride layer 3, an N-type gallium nitride layer 4, a multi-quantum well layer 5, and an electron blocking layer 6 sequentially stacked on the substrate 1 and P-type GaN layer 7 .
[0033] In this example, see figure 2 The multi-quantum well layer 5 includes a plurality of first sublayers 50 stacked in sequence, and each first sublayer 50 includes a quantum well layer 51 and a quantum barrier layer 52 stacked on the quantum well layer 51 . Each quantum well layer 51 is an indium gallium nitride layer, and each quantum barrier layer 52 in the multi-quantum well layer 5 except the quantum barrier layer 52 closest to the electron blocking layer 6 is a gallium nitride layer. see image 3 , the quantum barrier layer 52 closest to the electron blocking layer 6 in the ...
Embodiment 2
[0050] An embodiment of the present invention provides a method for manufacturing a light-emitting diode epitaxial wafer, which is suitable for manufacturing the light-emitting diode epitaxial wafer provided in Embodiment 1, see Figure 4 , the manufacturing method includes:
[0051] Step 201: Provide a substrate.
[0052] Step 202: sequentially growing a buffer layer, an undoped GaN layer, an N-type GaN layer, a multi-quantum well layer, an electron blocking layer and a P-type GaN layer on the substrate.
[0053] In this embodiment, the multi-quantum well layer includes a plurality of first sublayers stacked in sequence, each first sublayer includes a quantum well layer and a quantum barrier layer stacked on the quantum well layer, and each quantum well layer is InGaN layer, each quantum barrier layer in the multi-quantum well layer except the quantum barrier layer closest to the electron blocking layer is a gallium nitride layer, and the quantum barrier layer closest to the...
Embodiment 3
[0073] An embodiment of the present invention provides a method for manufacturing a light-emitting diode epitaxial wafer, and the manufacturing method provided in this embodiment is a specific realization of the manufacturing method provided in Embodiment 2. In this embodiment, Veeco K465i or C4 Metal Organic Chemical Vapor Deposition (English: Metal Organic Chemical Vapor Deposition, abbreviated: MOCVD) equipment is used to realize the manufacture of LED epitaxial wafers. Using high-purity hydrogen (H 2 ) or high-purity nitrogen (N 2 ) or high purity H 2 and high purity N 2 The mixed gas as the carrier gas, high-purity NH 3 As nitrogen source, trimethylgallium (TMGa) and triethylgallium (TEGa) as gallium source, trimethylindium (TMIn) as indium source, trimethylaluminum (TMAl) as aluminum source, silane (SiH4) as N-type dopant, magnesium dicene (CP 2 Mg) as a P-type dopant. The pressure of the reaction chamber is controlled at 100torr~600torr.
[0074] Specifically, se...
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