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Selective laser evaporation deposition method and device

An evaporative deposition and selective laser technology, which is applied in the field of additive manufacturing, can solve the problems that the roller or scraper cannot flatten the machined surface, the high cost of preparing powder, and the poor fluidity, etc., and achieves ideal molding effect, low cost, and fluidity. Good results

Inactive Publication Date: 2018-03-27
陕西百普生医疗科技发展有限公司
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Problems solved by technology

[0003] In the selective sintering molding process using polymer powder as the processing material, the material properties of the powder will have a major impact on the final molding effect of the part. The needle-shaped powder has poor fluidity compared to the spherical powder material, resulting in the roller Or the scraper cannot pave the processing surface, resulting in part defects
Moisture-prone powders need to be dried before sintering. For high molecular polymers with low melting points, liquid nitrogen cooling is required during grinding, and the cost of powder preparation is high.

Method used

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  • Selective laser evaporation deposition method and device

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Embodiment Construction

[0027] The content of the present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0028] see figure 1 , a selective laser evaporation deposition device includes: a computer 1, an optical path system, and a molding system, the optical path system includes a laser 8 and a scanning galvanometer 9 controlled by the computer 1; the molding system includes a heater 5, a temperature sensor, and a molding cylinder 4. Liftable forming tray 3, liquid replenishment scraper 2, liquid replenishment tank 7 and inert gas protection chamber 10.

[0029] The computer 1 and its control software are responsible for controlling the opening and closing of the laser 8, are responsible for converting the information of the layered processed model into relevant signals to control the motion track of the scanning galvanometer 9, and are responsible for opening and closing the heater. , responsible for controlling the lifting of the liftable m...

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Abstract

The invention discloses a selective laser evaporation deposition method and device. A saturated solution is taken as a forming material, a printing model is generated through a computer, and a signalis output through control software, so that motion of a scanning galvanometer is controlled, laser forms a point light source in a forming cylinder, a solution is evaporated, and solute is formed by deposition and sintering. The device comprises a light path system and a forming system which are connected with a computer, wherein the computer is connected with a laser unit and a scanning galvanometer; the forming system comprises a pre-heating device (a heater and a temperature sensor), a forming cylinder, a liftable forming tray, a fluid supplementing scraping plate, a fluid supplementing slot and an inert gas protective bin. The selective laser evaporation deposition method provides a novel personalized forming mode for a soluble high polymer material; and compared with an existing selective sintering technology using a powdered material, the selective laser evaporation deposition method adopts a liquid material, is good in mobility, is ideal in forming effect, does not need to prepare powder, is low in cost, is good in forming quality, is wide in processing material range, and the like.

Description

technical field [0001] The invention relates to the technical field of additive manufacturing, in particular to an area-selective laser evaporation deposition method and device. Background technique [0002] Selected laser sintering (SLS) is an additive manufacturing technology that has developed rapidly in recent years. It is mainly used in many fields such as machinery, aerospace, and bioengineering, involving various powder materials such as metals, ceramics, and polymers. The existing selective laser sintering technology converges the laser beam into a high-energy spot on the processing plane, and controls the spot through software to scan the powder material point by point or line by line according to a certain path. [0003] In the selective sintering molding process using polymer powder as the processing material, the material properties of the powder will have a major impact on the final molding effect of the part. The needle-shaped powder has poor fluidity compared ...

Claims

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Application Information

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IPC IPC(8): B29C64/135B29C64/20B29C64/268B33Y30/00B33Y10/00
CPCB33Y30/00B33Y10/00
Inventor 仝站国李雅静
Owner 陕西百普生医疗科技发展有限公司
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