Vulcanization molded single-component high-thermal-conductivity interstitial interface material with moisture and preparation method of interface material

Abstract

The invention discloses a vulcanization molded single-component high-thermal-conductivity interstitial interface material with moisture and a preparation method of the interface material, relates to the technical field of materials, and in particular relates to the high-thermal-conductivity interface material. The vulcanization molded single-component high-thermal-conductivity interstitial interface material with moisture is mainly prepared from the following components in parts by weight: 100 parts of alkoxy silicone oil, 100-1500 parts of thermal conductive powder, 0-10 parts of a chain extender, and 1-10 parts of a catalyst. The interface material provided by the invention takes the alkoxy silicone oil as a matrix, and the thermal conductive powder and the chain extender are added, so that the product has the advantages of good thermal conductivity, curing performance, low stress, good pressure absorption performance, a thin adhesive layer, high adhesion performance, convenient production, low costs, convenient sizing, on-line shaping and the like.

Description

technical field [0001] The invention relates to the field of material technology, in particular to a high thermal conductivity interface material. Background technique [0002] At present, in the field of high thermal conductivity interface materials, thermally conductive materials mainly include thermally conductive gaskets, thermally conductive silicone grease, and thermally conductive gels. When the thermal conductive gel is filled in a larger gap of 1mm or more, it is prone to slip and cannot be kept in the original position, especially when the heating device is placed perpendicular to the surface of the heat sink device, it is easier to slip, and the alternation of cold and heat and vibration of the environment will cause heat conduction The gel slides along the vertical direction and breaks away from its original position, resulting in the failure of the heat transfer function, causing the temperature of the heat-generating device to rise and shorten the life. Therma...

AI Technical Summary

Problems solved by technology

When the thermal conductive gel is filled in a larger gap of 1mm or more, it is prone to slip and cannot be kept in the original position, especially when the heating device is placed perpendicular to the surface of the heat sink device, it is easier to slip, and the alternating heat and cold and vibration of the environment will cause heat conduction The gel slides along the vertical direction and breaks away from its original position, resulting in the failure of the heat transfer function, causing the temperature of the heating device to rise and shorten the life

Thermal pads cannot be used when the required thickness is less than 0.5mm. After the equipment has been in operation for a period of time, the pad material will soften, creep, and stress relax, and the mechanical strength will also decrease.

Thermally conductive silicone grease tends to dry up after a certain period of time, and it needs to be manually applied to the surface of heating and cooling devices. It is inconvenient to apply on a large area, and it is easy to generate air bubbles, which will increase thermal resistance and reduce heat dissipation.