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Bionic vertex face heat conduction enhancement filler, preparation method and application in PBX (polymer bonded explosive)

A technology of thermal conductivity enhancement and thermal conductivity filler, which is applied in non-explosive fillers/gelling agents/thickeners, offensive equipment, explosives processing equipment, etc., which can solve problems such as uneven thermal expansion, affecting the reliability of weapon systems, and unfavorable heat transfer. , to achieve the effects of reducing thermal stress, good thermal conductivity, and enhancing thermal conductivity

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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, explosive crystals and polymer binders, typical components of PBX, are poor conductors of heat. When facing complex environments, they are not conducive to heat transfer. Temperature gradients are easily generated inside explosive components, resulting in uneven thermal expansion and heat generation. stress, which affects the reliability of the weapon system

Method used

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  • Bionic vertex face heat conduction enhancement filler, preparation method and application in PBX (polymer bonded explosive)
  • Bionic vertex face heat conduction enhancement filler, preparation method and application in PBX (polymer bonded explosive)
  • Bionic vertex face heat conduction enhancement filler, preparation method and application in PBX (polymer bonded explosive)

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Step 1: take 1.2g of Tris (Tris) and dissolve it in 1000ml of deionized water, then add hydrochloric acid dropwise to prepare a buffer solution with a pH value of 8.5, then add 2g of dopamine to the buffer solution, Stir evenly at a speed of 400 rpm. Add 500 mg of graphene after ultrasonic dispersion, start the self-polymerization reaction, time it, and finish the reaction after 6 hours. Wash with deionized water, suction filter, and vacuum-dry in a 50°C oven; after that, weigh 500mg of modified graphene filler, add it to 500ml of silver nitrate solution with a concentration of 0.1mol / L, stir evenly at a speed of 400rpm, and start Timing, the reaction ends after 6h. Washing with deionized water, suction filtration, and vacuum drying in an oven at 50°C can obtain a bionic point-surface thermal conductivity enhancing filler in the present invention.

[0036]Step 2: Weigh 0.5g of the thermally conductive enhancing filler prepared in step 1, add it to ethyl acetate, dispe...

Embodiment 2

[0040] Step 1: take 1.2g of Tris (Tris) and dissolve it in 1000ml of deionized water, then add hydrochloric acid dropwise to prepare a buffer solution with a pH value of 8.5, then add 2g of dopamine to the buffer solution, Stir evenly at a speed of 400 rpm. Add 1 g of graphene nanosheets after ultrasonic dispersion, start the self-polymerization reaction, time it, and finish the reaction after 6 hours. Wash with deionized water, suction filter, and vacuum-dry in a 50°C oven; after that, weigh 1g of modified graphene nanosheets, add them to 500ml of silver ammonia solution with a concentration of 0.1mol / L, and then add 0.1g of stabilizer poly Vinylpyrrolidone was stirred evenly at a speed of 400rpm, the timing was started, and the reaction was finished after 6h. Washing with deionized water, suction filtration, and vacuum drying in an oven at 50°C can obtain a bionic point-surface thermal conductivity enhancing filler in the present invention.

[0041] Step 2: Weigh 1g of the...

Embodiment 3

[0044] Step 1: take 1.2g of Tris (Tris) and dissolve it in 1000ml of deionized water, then add hydrochloric acid dropwise to prepare a buffer solution with a pH value of 8.5, then add 4g of dopamine to the buffer solution, Stir evenly at a speed of 400 rpm. Add 1 g of boron nitride nanosheets dispersed by ultrasonic to start the self-polymerization reaction, time it, and finish the reaction after 4 hours. Wash with deionized water, filter with suction, and dry in a vacuum oven at 50°C; after that, weigh 1g of modified boron nitride nanosheets and add to 500ml of HAuCl chloroaurate with a concentration of 0.05mol / L 4 In the solution, stir evenly at a speed of 400 rpm, start timing, and end the reaction after 6 hours. Washing with deionized water, suction filtration, and vacuum drying in an oven at 50°C can obtain a bionic point-surface thermal conductivity enhancing filler in the present invention.

[0045] Step 2: Weigh 1g of the thermally conductive enhancing filler prepare...

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Abstract

The invention discloses a bionic vertex face heat conduction enhancement filler which is prepared from the following raw materials based on the total weight which is 100 percent: 60 to 85 percent of asheet-like heat conduction filler, 8 to 19 percent of bionic polydopamine and 5 to 25 percent of high-heat-conduction metal nano particles. The invention further provides a preparation method of thebionic vertex face heat conduction enhancement filler. The invention further discloses application of the bionic vertex face heat conduction enhancement filler in a PBX (polymer bonded explosive). Thebionic vertex face heat conduction enhancement filler can fulfill the aim of further enhancing the heat conduction performance of the filler, and is high in heat conduction performance. When the PBXis filled with the high-heat-conduction enhancement filler, the heat conduction performance of the PBX can be substantially improved at a low content, and thermal stress inside a PBX component in faceof a complicated environment is effectively reduced; the method is simple, efficient, green and environmentally friendly. The bionic vertex face heat conduction enhancement filler is suitable for large batch production, and has an important application prospect.

Description

technical field [0001] The invention relates to the technical field of preparation of heat-conducting composite materials, in particular to a bionic point-surface heat-conducting enhancing filler and a preparation method thereof, and a PBX mixed explosive containing heat-conducting enhancing filler and a preparation method thereof. Background technique [0002] Adding fillers with high thermal conductivity is the easiest and quickest way to enhance the thermal conductivity of polymer materials. A large number of studies have shown that filling high thermal conductivity fillers into polymer materials can significantly improve the thermal conductivity of composite materials. However, the thermal conductivity of this filled composite material is still significantly lower than the predicted value. There is a huge interfacial thermal resistance between them and the filler itself has structural defects. On the one hand, the interfacial thermal resistance is caused by phonon scatt...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C06B23/00C06B25/04C06B25/34C06B21/00
CPCC06B21/0008C06B23/001C06B25/04C06B25/34
Inventor 何冠松巩飞艳曾诚成林聪妹刘佳辉杨志剑
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