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Preparation method of low-temperature sintered electronic ceramic material

A low-temperature sintering technology for electronic ceramics, applied in the field of electronic ceramic materials, can solve the problems of inability to use conductive metals, etc., and achieve the effects of reducing production costs, simple formula, and reducing the content of impurities

Inactive Publication Date: 2018-02-16
HUNAN JIAYEDA ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Electronic ceramics refer to ceramics that can use electricity and magnetic properties in the electronics industry. Electronic ceramics are ceramics with new functions that are finally obtained through precise control of the surface, grain boundaries, and dimensional structures. They are used in energy, household appliances, automobiles, etc. It can be widely used in the production of electronic functional components, most of which are sintered materials mainly composed of oxides. The manufacturing process of electronic ceramics is roughly the same as that of traditional ceramics. In terms of chemical composition, microstructure and electromechanical properties, All of them are essentially different from general power ceramics. These differences are formed by a series of special technical requirements put forward by the electronics industry for electronic ceramics. The most important of which are high mechanical strength, high temperature and high humidity resistance, and Radiation, the dielectric constant changes in a wide range, the dielectric loss tangent is small, the capacitance temperature coefficient can be adjusted (or the capacitance change rate can be adjusted), the dielectric strength and insulation resistance are high, and the aging performance is excellent, etc., However, the preparation of traditional electronic ceramic materials requires high-temperature sintering, so that when electronic ceramic materials are used for co-firing, only some metals with high melting points, such as tungsten, cannot be used, such as silver with better conductivity.

Method used

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preparation example Construction

[0022] refer to Figure 1-2 , a preparation method of low-temperature sintered electronic ceramic material, comprising the following steps:

[0023] The first step: mix various preparation raw materials in proportion, grind the raw materials and add them to the solvent, prepare a suspension by adding a suspending agent, pass through the casting nozzle, and the suspension slurry flows to the steadily rotating endless steel belt by its own weight, and passes through The raw material film is obtained by drying in multiple cycles.

[0024] Step 2: add binder and plasticizer to the raw material film, mix and grind once through a ball mill to get the mixture powder, put the mixture powder into the drying box, and stay between 80°C and 120°C for six to twelve Hours, drying and drying.

[0025] Step 3: Put the dried mixture powder into the pre-sintering furnace for pre-sintering treatment, put the dried mixture powder into the pre-sintering furnace, adjust the pre-sintering furnace ...

Embodiment 1

[0033] A method for preparing a low-temperature sintered electronic ceramic material. The raw materials for the preparation include the following materials in parts by weight: 20 parts of titanium oxide, 10 parts of zirconium silicate, 4 parts of calcium oxide, 5 parts of nickel oxide, 5 parts of copper oxide, magnesium titanate 3 parts, 15 parts of iron oxide and 15 parts of zinc oxide are mixed.

Embodiment 2

[0035] A method for preparing a low-temperature sintered electronic ceramic material. The raw materials for the preparation include the following materials in parts by weight: 25 parts of titanium oxide, 15 parts of zirconium silicate, 8 parts of calcium oxide, 7 parts of nickel oxide, 8 parts of copper oxide, magnesium titanate 6 parts, 17 parts of iron oxide and 18 parts of zinc oxide are mixed.

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Abstract

The invention discloses a preparation method of a low-temperature sintered electronic ceramic material. The preparation method comprises the following steps: mixing a plurality of preparation raw materials according to the proportions; grinding the raw materials and adding the ground raw materials into a solvent; preparing suspension by adding a suspending agent, and enabling suspension slurry toflow to a stably-rotating annular steel strip through a casting nozzle by means of gravity; carrying out circular drying for multiple times to obtain a raw material thin film; adding a binder and a plasticizer into the raw material thin film; carrying out first-time mixing and grinding by a ball mill to obtain mixed material powder; putting the mixed material powder into a drying oven. According to the preparation method disclosed by the invention, the density of a blank body is more uniform; the quality of the obtained electronic ceramic material is high, and the electronic ceramic material can be prepared by low-temperature sintering forming; when the obtained electronic ceramic material is cofired, metals with better properties such as silver with better conductive property can be used;meanwhile, a formula is simple and low in price, so that the preparation cost of the low-temperature sintered electronic ceramic material is reduced.

Description

technical field [0001] The invention relates to the technical field of electronic ceramic materials, in particular to a preparation method of low-temperature sintered electronic ceramic materials. Background technique [0002] Electronic ceramics refer to ceramics that can use electricity and magnetic properties in the electronics industry. Electronic ceramics are ceramics with new functions that are finally obtained through precise control of the surface, grain boundaries, and dimensional structures. They are used in energy, household appliances, automobiles, etc. It can be widely used in the production of electronic functional components, most of which are sintered materials mainly composed of oxides. The manufacturing process of electronic ceramics is roughly the same as that of traditional ceramics. In terms of chemical composition, microstructure and electromechanical properties, All of them are essentially different from general power ceramics. These differences are fo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/49C04B35/626C04B35/634C04B35/622
CPCC04B35/481C04B35/49C04B35/622C04B35/6261C04B35/62645C04B35/62695C04B35/63496C04B2235/3206C04B2235/3208C04B2235/3236C04B2235/3272C04B2235/3279C04B2235/3281C04B2235/3284C04B2235/6562C04B2235/6567
Inventor 戴承萍
Owner HUNAN JIAYEDA ELECTRONICS
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