Method for removing flux from surface of substrate and chip on substrate

Abstract

The invention discloses a method for removing flux from the surface of a substrate and a chip on the substrate. The method comprises the following steps of 1, cleaning flux on the substrate and the chip on the substrate by a water-based cleaning reagent firstly; 2, performing cleaning on the substrate and the chip on the substrate after being cleaned in the step 1 by adopting a bromopropane gaseous phase cleaning technology; and 3, performing argon plasma cleaning on the substrate and the chip on the substrate after being cleaned in the step 2 by adopting a plasma cleaning system. By adoptionof the method, the flux and pollutants on an electronic assembly can be removed, and the residual flux in the tiny gaps also can be completely taken away; in addition, the surface activity on the electronic assembly also can be changed, and the surface bonding state between a transmission line and a gold wire bonding pad also can be improved, thereby improving the bonding adhesive property and improving the bonding process reliability; by virtue of the method, the cleaning efficiency is improved, the yield is high and the process is simple; and low toxicity can be realized as far as possible on the basis that the cleaning capability can be satisfied, and strong respiratory tract irritation can be avoided.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a method for removing flux on a substrate and a chip surface thereon. Background technique [0002] With the continuous development of integrated circuit technology, electronic products are increasingly developing in the direction of miniaturization, intelligence, high performance, and high reliability. With the gradual reduction of the size of integrated circuit chips and the continuous improvement of integration, the electronics industry is increasingly concerned about the integration Circuit packaging technology puts forward higher and higher requirements. The quality of chip bonding area and frame bonding area plays a very important role in the reliability of integrated circuit devices. As the package is the only connection between the device and the electronic system, the bonding area must be free of contaminants and have good bonding characteristics. I...

AI Technical Summary

Problems solved by technology

However, the prior art must use a very large amount of clear water or solvents to remove the flux or oil stains on the surface of the electronic components, and the clear water used for flushing cannot be recycled because it has been mixed with flux or oil stains, but must be sent to Wastewater treatment plant, this not only increases the manufacturing cost, but also wastes water resources. The circuit board is prone to static electricity due to the friction of the brush, so the cleaning method of the brush cannot be used