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A polyacrylate emulsion pressure-sensitive adhesive for electronic protective film, its preparation method and application

A polyacrylate emulsion, acrylate technology, applied in the direction of pressure sensitive film/sheet, ester copolymer adhesive, adhesive type, etc. Emissions and other issues, to ensure weather resistance, improve rigidity, and save costs

Active Publication Date: 2021-01-05
WUXI HAITE NEW MATERIAL RES INST +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the acrylic pressure-sensitive adhesives used for electronic protective films are mainly solvent-based acrylic pressure-sensitive adhesives, which have excellent optical and weather resistance properties, but solvent-based acrylic pressure-sensitive adhesives contain organic solvents such as toluene, Ethyl acetate, etc., are very dangerous in the process of production, storage and transportation, and there are a lot of VOC emissions. The coating process affects the health of operators and the cost is high. This series of safety, environmental protection and cost issues prompt people to urgently develop new pressure sensitive adhesive

Method used

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  • A polyacrylate emulsion pressure-sensitive adhesive for electronic protective film, its preparation method and application
  • A polyacrylate emulsion pressure-sensitive adhesive for electronic protective film, its preparation method and application
  • A polyacrylate emulsion pressure-sensitive adhesive for electronic protective film, its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Weigh 0.3g reactive anionic emulsifier sodium vinylsulfonate, 0.1g reactive anionic emulsifier 1-propenyloxy 2-hydroxypropanesulfonate sodium, 0.15g reactive nonionic emulsifier allyloxypolyoxyethylene (10) Ether, 33g of deionized water, stirred at room temperature to obtain emulsifier aqueous solution; slowly add 0.3g of N-methylolacrylamide, then add 80g of isooctyl acrylate, 6g of isobornyl methacrylate, and 1.5g of methacrylic acid to form The mixed monomers were stirred for 45min at a stirring speed of 800r / min to prepare pre-emulsion 1.

[0035] Take 0.15g of glycidyl methacrylate, 10g of isooctyl acrylate, and 2g of methyl methacrylate and mix evenly to prepare mixed solution 2.

[0036] Weigh 0.2 g of potassium persulfate, add 10 g of deionized water to dissolve, and prepare initiator aqueous solution 3.

[0037] Heat 70g of deionized water to 80°C, add 10% of the initiator solution 3 prepared above, after 5 minutes, add 77% of the pre-emulsion 1 and initiator ...

Embodiment 2

[0044] Weigh 0.3g reactive anionic emulsifier sodium vinylsulfonate, 0.1g reactive anionic emulsifier allylsulfonate sodium, 0.2g reactive nonionic emulsifier allyloxy polyoxyethylene (10) ether, 30g Deionized water, stirred at room temperature to obtain emulsifier aqueous solution; slowly add 75g of butyl acrylate, 3g of methyl methacrylate, 1.5g of methacrylic acid, 1g of hydroxyethyl methacrylate, 0.2g of N-methylolacrylamide The monomer was stirred for 45 minutes at a stirring speed of 800 r / min to prepare pre-emulsion 1.

[0045] Mix 10 g of isooctyl acrylate and 3 g of methyl acrylate to prepare mixed solution 2.

[0046] Weigh 0.3 g of sodium persulfate, add 24 g of deionized water to dissolve, and prepare initiator aqueous solution 3.

[0047] Heat 66g of deionized water to 82°C, add 12% initiator aqueous solution, add pre-emulsion 1 and 73% initiator aqueous solution 3 to the reaction solution dropwise at the same time for 2.5h, then raise the temperature to 86°C, an...

Embodiment 3

[0054]Weigh 0.5g reactive anionic emulsifier sodium vinyl sulfonate, 0.3g reactive nonionic emulsifier allyloxy polyoxyethylene (10) ether, 25g deionized water, stir at room temperature to obtain emulsifier aqueous solution; slowly add 45g A mixed monomer composed of isooctyl acrylate, 15g butyl acrylate, 2.4g isobornyl methacrylate, 1.5g methacrylic acid and 0.15g N-methylolacrylamide was stirred for 40min at a stirring speed of 800r / min to obtain Pre-emulsion 1.

[0055] Mix 15g of isooctyl acrylate and 1.6g of isobornyl methacrylate evenly to prepare mixed solution 2.

[0056] Weigh 0.5 g of sodium persulfate, add 10 g of deionized water to dissolve, and prepare initiator aqueous solution 3.

[0057] Heat 70g of deionized water to 79°C, add 8% initiator aqueous solution, drop pre-emulsion 1 and 75% initiator aqueous solution 3 into the reaction solution at the same time for 2.5h, then raise the temperature to 86°C, and keep it warm for 0.5h. Then, the mixed solution 2 and...

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Abstract

The invention discloses a polyacrylate emulsion pressure-sensitive adhesive for electronic protective films, a preparation method and application thereof. The polyacrylate emulsion pressure-sensitiveadhesive for electronic protective films includes 0.008-0.02 part of an external crosslinking agent and a coating agent, wherein the coating agent comprises the following components by weight: 75-100parts of an acrylate soft monomer, 4-13 parts of an acrylate hard monomer, 1.5-3.5 parts of a polar monomer, 0.15-0.45 part of an internal crosslinking monomer, 0.3-0.5 part of a reactive anionic emulsifier, 0.15-0.3 part of a reactive nonionic emulsifier, 0.2-0.5 part of an initiator, 100-150 parts of deionized water, and 0.5-1.5 parts of a PH regulator. The polyacrylate emulsion pressure-sensitive adhesive for electronic protective films provided by the invention can improve the rigidity of a polymer structure, ensures the weather resistance of pressure sensitive adhesive, uses water insteadof organic solvent to serve as the medium, is low carbon and environment-friendly, and saves cost.

Description

technical field [0001] The invention relates to the technical field of water-based pressure-sensitive adhesives, in particular to a polyacrylate emulsion pressure-sensitive adhesive for electronic protection films, its preparation method and its application. Background technique [0002] Acrylic pressure-sensitive adhesives used for electronic protective films require high optical properties and weather resistance, high light transmittance and aging resistance, because electronic devices will generate radiation during use, and radiation will gradually affect the light transmission of the adhesive layer properties and the stability of the adhesive layer. [0003] At present, the acrylic pressure-sensitive adhesives used for electronic protective films are mainly solvent-based acrylic pressure-sensitive adhesives. Solvent-based acrylic pressure-sensitive adhesives have excellent optical and weather resistance properties, but solvent-based acrylic pressure-sensitive adhesives c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F220/18C08F220/06C08F220/14C08F220/32C08F220/58C08F2/26C08F2/30C09J7/38C09J133/08
Inventor 陈国荣李小静丁荣炎吴秋心白永平李晶波席丹殷晓芬
Owner WUXI HAITE NEW MATERIAL RES INST
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