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Magnetorheological polishing adhesive and preparation method thereof

A magnetorheological polishing and gel technology, applied in the field of magnetorheological polishing glue and its preparation, can solve the problems of limited application of workpiece expansion, limited shear yield stress, low material removal rate, etc. The effect of low cost and simple preparation process

Active Publication Date: 2018-01-12
BEIJING JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the current ultra-smooth surface processing technology is mostly fixed abrasive or free abrasive processing. For example, the widely used chemical mechanical polishing method is a typical free abrasive processing. However, these processing methods are all rigid contact, which is easy to produce scratches on the surface of the workpiece. marks or residual stress, which greatly restricts the subsequent expansion and application of the workpiece
In terms of flexible polishing, magnetorheological polishing has been studied more, but the shear yield stress that magnetorheological fluid can achieve under the action of a magnetic field is limited, and the material removal rate is relatively low.

Method used

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  • Magnetorheological polishing adhesive and preparation method thereof
  • Magnetorheological polishing adhesive and preparation method thereof
  • Magnetorheological polishing adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] A magnetorheological polishing gel provided in an embodiment of the present invention is composed of carbonyl iron powder, polishing powder, gel and fumed silica in the dispersed phase, and deionized water and glycerin in the continuous phase. Include the following components by weight percentage:

[0038]

[0039] In the above magnetorheological polishing glue, preferably, the particle size of the carbonyl iron powder ranges from 1 μm to 10 μm.

[0040] In the above magnetorheological polishing glue, preferably, the polishing powder can be one or more of alumina, carbon dioxide, cerium oxide, silicon carbide or diamond abrasives, with a particle size ranging from 20 nm to 5 μm.

[0041] In the above-mentioned magnetorheological polishing glue, preferably, the particle size range of fumed silica is 10nm-50nm.

[0042] The embodiment of the present invention also provides a preparation method of the above-mentioned magnetorheological polishing gel. During the prepara...

Embodiment 2

[0050] The embodiment of the present invention provides a magnetorheological polishing glue, the mass percentage of each component is: 50% carbonyl iron powder, 5% polishing powder, 3% gel, 1% fumed silica, 22 % deionized water, 20% glycerin.

[0051]In the embodiment of the present invention, the particle size distribution range of the carbonyl iron powder is 1 μm to 10 μm, and the average particle size is 3.5 μm.

[0052] In the embodiment of the present invention, the polishing powder can be aluminum oxide, the particle size range is 20nm-70μm, and the average particle size is 50nm.

[0053] In the embodiment of the present invention, the particle size range of fumed silica is 10nm-50nm, and the average particle size is 20nm.

[0054] The embodiment of the present invention also provides a preparation method of the above-mentioned magnetorheological polishing glue, the preparation steps include:

[0055] Step 1. According to the above formula of magnetorheological polishi...

Embodiment 3

[0061] The mass percent of each component of a kind of magnetorheological polishing gel of the present invention that this embodiment provides is, 45% carbonyl iron powder, 5% polishing powder, 3% gel, 1% fumed silica , 22% deionized water, 25% glycerin.

[0062] The preparation method of the magnetorheological polishing liquid for gallium arsenide polishing in the second embodiment of the present invention is basically the same as that in the first embodiment, the only difference is that the mass percentage of each component is 45% carbonyl iron powder and 5% polishing powder , 3% gel, 1% fumed silica, 22% deionized water, 25% glycerin.

[0063] like Figure 5 , 6 As shown, the magnetorheological polishing glue prepared in Example 2 of the present invention keeps its shape well in the absence of a magnetic field and an external magnetic field after it has been refrigerated for 15 days.

[0064] In summary, the magnetorheological polishing glue provided by the embodiment of...

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Abstract

The invention provides a magnetorheological polishing adhesive and a preparation method thereof. The magnetorheological polishing adhesive is composed of carbonyl iron powder (30%-70%), polishing powder (2%-7%), gel (0.5%-5%), gas-phase silicon dioxide (0.2%-1.5%), deionized water (10%-35%), and glycerol (15%-40%). The preparation method comprises the following steps: (1) weighing the carbonyl iron powder, the polishing powder, the gas-phase silicon dioxide, the gel, the deionized water and the glycerol according to a formula of the magnetorheological polishing adhesive; (2) putting the glycerol and the deionized water into a container, performing stirring to obtain a glycerol aqueous solution, performing heating, dissolving the gel into the glycerol aqueous solution under stirring to forma mixed solution; (3) adding the weighed carbonyl iron powder, the weighed gas-phase silicon dioxide, and the weighed polishing powder to the mixed solution in sequence, and performing stirring to obtain a magnetorheological polishing adhesive; and (4) putting the formed magnetorheological polishing adhesive into a refrigerating chamber, performing refrigeration, and taking the adhesive out whenusing. The magnetorheological polishing adhesive provided by the invention has the simple preparation method, higher stability and a higher shear yield stress, and can meet performance requirements ofprocessing.

Description

technical field [0001] The invention relates to the technical field of ultra-smooth polishing, in particular to a magnetorheological polishing glue and a preparation method thereof. Background technique [0002] With the rapid development of modern science and technology, there are more and more demands for ultra-smooth surfaces in many fields such as microelectronics, optics and aviation industry. An ultra-smooth surface refers to a surface with a surface roughness less than 1 nm. However, the current ultra-smooth surface processing technology is mostly fixed abrasive or free abrasive processing. For example, the widely used chemical mechanical polishing method is a typical free abrasive processing. However, these processing methods are all rigid contact, which is easy to produce scratches on the surface of the workpiece. There are no traces or residual stress, which greatly restricts the subsequent expansion and application of the workpiece. In terms of flexible polishin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09G1/02H01F1/44
Inventor 曹建国李建勇朱朋哲聂蒙徐金环
Owner BEIJING JIAOTONG UNIV
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