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Display panel, display panel preparation method, and display device

A technology for display panels and substrates, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as incomplete exposure, short circuit of laminated metal lines, and uneven thickness of photoresist coating

Active Publication Date: 2018-01-09
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of the above problems, the object of the present invention is to provide a display panel and its preparation method, and a display device, which solves the problem of uneven coating thickness of the resist and incomplete exposure during the preparation of the laminated metal lines, which lead to short circuits of the laminated metal lines. question

Method used

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  • Display panel, display panel preparation method, and display device
  • Display panel, display panel preparation method, and display device
  • Display panel, display panel preparation method, and display device

Examples

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no. 1 example

[0039] see Figure 4 and Figure 5 , the second metal line 131 is disposed on the insulating layer 140 , and the second metal line 131 partially falls within the first metal line 121 a in the orthographic projection area on the first metal layer 120 , and the other part falls into the first gap 122 area adjacent to the first metal line 121b area. The distance between the first metal lines 121a and 121b is L. During the preparation process of the second metal line 131, the mask 170 is shifted in the X direction from the position facing the first metal line 121 by a1, and a1 is less than L. After coating the photoresist 160 on the metal layer 150, aligning the mask 170 and photolithography, the second metal lines 131 are obtained, as shown in Figure 4 shown. At this time, there may be locally thick photoresist 160a at the recess 141 that is difficult to complete, and some metal 151 may remain. If the metal is completely removed, the short circuit between the second metal l...

no. 2 example

[0041] see Image 6 and Figure 7 , the second metal line 131 is disposed on the insulating layer 140 , and the second metal line 131 partially falls within the first metal line 121 a in the orthographic projection area on the first metal layer 120 , another part covers the first gap 122 adjacent to the first metal line 121a region, and another part falls into the first metal line 121b region adjacent to the first metal line 121a region. The distance between the first metal lines 121a, 121b is L. In the process of preparing the second metal line 131, the mask 170 is shifted along the X direction from the position facing the first metal line 121 by a2, and a2 is greater than L, and the width of the second metal line 131 is greater than that of the first metal line Spacing between 121a, 121b. In this embodiment, the second metal wire 131 spans the first gap 122 in the width direction. Preferably, the central axis of the second metal wire 131 may be collinear with the central ...

no. 3 example

[0043] see Figure 8 and Figure 9 , the second metal line 131 is disposed on the insulating layer 140, and the orthographic projection area of ​​the second metal line 131 on the first metal layer 120 falls into the first metal line 121a and the adjacent between the first metal lines 121b. The distance between the first metal lines 121a, 121b is L. In the process of preparing the second metal line 131, the mask 170 is shifted along the X direction from the position facing the first metal line 121 by a3, and a3 is smaller than L, and the width of the second metal line 131 is smaller than that of the first metal line The distance between 121 a and 121 b , that is, the orthographic projection area of ​​the second metal line 131 on the first metal layer 120 falls into the area of ​​the first gap 122 . Preferably, the central axis of the second metal wire 131 may be collinear with the central axis of the first gap 122 , that is, two adjacent second metal wires may be arranged be...

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Abstract

The invention provides a display panel. The display panel comprises a first metal layer and a second metal layer which are arranged in sequence, wherein the first metal layer comprises a plurality offirst metal wires, and first gaps among the first metal wires; the second metal layer comprises a plurality of second metal wires which are arranged at intervals; extension directions of the second metal wires are identical to extension directions of the first metal wires; the second metal wires and the first metal wires are arranged in a staggered manner; and orthographic projection areas of thesecond metal wires on the first metal layer are located in first gap areas, so that short circuits between the adjacent second metal wires during preparation of the second metal wires can be avoided.The invention further provides a display panel preparation method, and a display device. The display panel, the display panel preparation method and the display device provided by the invention have the advantage that the problem that short circuits of laminated metal wires are caused by an uneven photoresist coating thickness and incomplete exposure during preparation of the laminated metal wiresis solved.

Description

technical field [0001] The invention relates to the field of electronic equipment, in particular to a display panel, a preparation method thereof, and a display device. Background technique [0002] As consumers have higher and higher requirements for display resolution specifications, higher and higher requirements for display size, and higher pursuit of ultra-narrow bezel visual effects, the number of light-emitting driving devices in displays is increasing. , which also increases the load on the data lines and the drive scan lines. In order to reduce the load of the data lines and driving scan lines, the traces in the fan-out area of ​​the display are made of double-layer metal lines. Due to the design requirements of ultra-narrow bezels, the line width and line spacing of the fan-out area are usually small. In addition, in order to reduce the overall in-plane load such as data lines and drive scan lines, usually two layers of metal lines are used. thicker. Under the p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/12H01L21/77
CPCH01L27/1244H01L27/1288
Inventor 李文英刘晓娣
Owner SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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