Hot-pressing buffer sheet and preparation method thereof

Abstract

The invention discloses a hot-pressed buffer sheet and a preparation method thereof. The hot-pressed buffer sheet and the preparation method thereof comprise a Teflon glass fiber cloth, an adhesive and a heat-conducting silica gel layer, and the surface of the Teflon glass fiber cloth is coated with an adhesive , the adhesive forms an adhesive layer, and the adhesive is made of the following materials in mass fraction: 30-40% of organosilicon-modified silicon resin, 30-40% of silane coupling agent, 10-20% of organic solvent and liquid resistant 10-20% warming agent, and a heat-conducting silica gel layer is arranged on the adhesive layer, and the heat-conducting silica gel layer is composed of heat-conducting silica gel with a mass fraction of 100%, 0.2-3% A / B platinum vulcanizing agent or 1-5% bis Four or 1-5% double 25, 5-30% conductive adhesive or 5-30% conductive powder, 2-5% carbon nanotubes, nano-titanium oxide and silica gel wetting agent. Through the above method, the present invention has good heat resistance, conductivity and release property, is not easy to delaminate, and has a long service life.

Description

technical field [0001] The invention relates to buffer materials in LCD, LED, TCP Bonding, PCB Bonding, PWB Bonding and other manufacturing processes, in particular to a heat-pressed buffer sheet and a preparation method thereof. Background technique [0002] Hot pressing buffer sheet is mainly used in the process of LCD, LED, TCP Bonding, PCB (Printed Circuit Board) Bonding, PWB (Printed Wiring Board) Bonding, as a hot pressing buffer for anisotropic conductive film, (isotropic Orientation conductive film (a viscous film in which conductive particles are uniformly distributed), the purpose is to conduct the thermal head to the ACF at high temperature to soften it and produce an adhesive effect, and as a contact buffer material for the thermal head, the traditional thermal The pressure buffer material generally uses a heat-conducting silica gel sheet as the buffer material. Its disadvantage is that it is not easy to leave after high-pressure pressing, and it is easy to leave...

AI Technical Summary

Problems solved by technology

[0002] Hot pressing buffer sheet is mainly used in the process of LCD, LED, TCP Bonding, PCB (Printed Circuit Board) Bonding, PWB (Printed Wiring Board) Bonding, as a hot pressing buffer for anisotropic conductive film, (isotropic Orientation conductive film (a viscous film in which conductive particles are uniformly distributed), the purpose is to conduct the thermal head to the ACF at high temperature to soften it and produce an adhesive effect, and as a contact buffer material for the thermal head, the traditional thermal The pressure buffer material generally uses a heat-conducting silica gel sheet as the buffer material. Its disadvantage is that it is not easy to leave after high-pressure pressing, and it is easy to leave the silica gel on the product. Up to about 15 times, the production efficiency is low in the module and PCB process

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