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Circuit board and fabrication method thereof

A production method and circuit board technology, which are applied in the directions of printed circuit manufacturing, circuit cover, printed circuit, etc., can solve the problems of reducing the utilization rate of flexible circuit board typesetting, unfavorable for high-density circuit production, etc., so as to increase the typesetting utilization rate, improve the Yield, the effect of meeting production needs

Active Publication Date: 2017-11-28
AVARY HLDG (SHENZHEN) CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when making circuits, the holes on the flexible circuit board need to increase the hole ring to enhance its connection function, which reduces the utilization rate of the layout of the flexible circuit board, which is not conducive to the production of high-density circuits.

Method used

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  • Circuit board and fabrication method thereof
  • Circuit board and fabrication method thereof
  • Circuit board and fabrication method thereof

Examples

Experimental program
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Effect test

Embodiment Construction

[0042] The following will be combined with Figure 1 to Figure 20 and an embodiment, the circuit board 100 provided by the technical solution and its manufacturing method are further described in detail. The circuit board 100 can be used in a high-density circuit board (HDI board), a rigid-flex board or a chip carrier board (IC carrier board).

[0043] see Figure 1 to Figure 8 , the first embodiment of the present invention provides a method for manufacturing a circuit board 100, including the following steps:

[0044] For a first step, see figure 1 , providing a substrate 10 .

[0045] The substrate 10 is double-sided, and the substrate 10 includes a base layer 11 , a first bottom copper layer 12 and a second bottom copper layer 13 formed on opposite sides of the base layer 11 .

[0046] In this embodiment, the base layer 11 is a flexible resin layer, such as polyimide (Polyimide, PI), polyethylene terephthalate (Polyethylene Terephthalate, PET) or polyethylene naphthala...

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Abstract

A circuit board comprises a substrate layer, a first conductive pattern layer and a second conductive pattern layer, wherein the first conductive pattern layer and the second conductive pattern layer are formed at two sides of the substrate layer, at least one first hole is formed in a region, which is not covered by the first conductive pattern layer, of the substrate layer and penetrates through the substrate layer, the circuit board also comprises a conductive circuit layer, the conductive circuit layer at least comprises a first part and a second part, the second part is connected with the first part, the first hole is filled with the first part, the second part is formed by protruding and extending the first part towards a direction far away from the substrate layer, the diameter of the second part is smaller than the diameter of the first hole, and the conductive circuit layer is electrically connected with the first conductive pattern layer and the second conductive pattern layer.

Description

technical field [0001] The invention relates to a circuit board and a manufacturing method thereof. Background technique [0002] At present, many flexible circuit boards will have high complexity, high precision, and high density wiring requirements. However, during circuit fabrication, holes on the flexible circuit board need to be increased with rings to enhance their connection function, which reduces the utilization rate of flexible circuit board layout and is not conducive to the production of high-density circuits. Contents of the invention [0003] In view of this, the present invention provides a method for manufacturing a circuit board that avoids the existence of an annular structure. [0004] Also provided is a circuit board that avoids the presence of the annular ring structure. [0005] A method for manufacturing a circuit board, comprising the steps of: [0006] A substrate is provided, the substrate includes a base layer, a first bottom copper layer and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11H05K3/40
CPCH05K1/115H05K3/4038H05K2201/096H05K3/108H05K3/427H05K2201/0367H05K2201/098H05K2201/09845H05K2203/0353H05K1/0298H05K1/09H05K3/0011H05K3/0073H05K3/02H05K3/4644H05K2201/095
Inventor 李艳禄杨梅李成佳
Owner AVARY HLDG (SHENZHEN) CO LTD
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