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Slab laser crystal package method and slab laser crystal

A technology of laser crystals and packaging methods, which is applied in the direction of lasers, laser components, and the structure/shape of active media, etc., can solve the problems of laser crystals that are prone to voids or virtual welding, etc., and achieve improved beam quality and reliability, and simple operation , Improve the cooling effect

Active Publication Date: 2017-11-24
11TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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Problems solved by technology

[0003] In view of the above analysis, the present invention aims to provide a packaging method for a slab laser crystal and a slab laser crystal, so as to solve the problem that the large-size slab laser crystal produced by the prior art is prone to voids or virtual welds

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  • Slab laser crystal package method and slab laser crystal

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Embodiment Construction

[0024] Preferred embodiments of the present invention will be specifically described below in conjunction with the accompanying drawings, wherein the accompanying drawings constitute a part of the application and are used together with the embodiments of the present invention to explain the principle of the present invention. For the sake of clarity and simplicity, detailed descriptions of known functions and constructions in the devices described herein will be omitted when it may obscure the subject matter of the present invention.

[0025] The present invention utilizes the characteristic that the entire lath laser crystal absorbs the pumping light and the medium as a whole generates heat, and realizes that by heating the lath laser crystal as a whole, the solder in contact with it can quickly reach the melting point, and complete the welding with the heat sink after melting. After the pumping light is applied to the slab laser crystal, the whole slab laser crystal will gene...

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Abstract

The invention discloses a slab laser crystal package method and a slab laser crystal. The package method for the large-size slab laser crystal can finish the welding process in a short time, thereby greatly reducing generation of large-size holes and pseudo soldering of the slab laser crystal and a welding layer between upper and lower heat sinks, improving the heat radiation effect of the solid slab laser crystal and improving light beam quality and reliability of the slab laser crystal. The method is easy to operate and easy to realize.

Description

technical field [0001] The invention relates to the technical field of laser crystals, in particular to a packaging method for a slab laser crystal and a slab laser crystal. Background technique [0002] At present, the packaging of the slab laser module mainly adopts the low-temperature welding method of solder indium or gold-tin alloy. The traditional welding process is to plate indium or place gold-tin alloy solder sheets on the welding surfaces of the upper and lower heat sinks, and the slab laser crystal Assemble, and then put the assembled slab laser crystal into a vacuum welding furnace to complete heating and welding. Small-sized slab laser crystal lasers can obtain high power and good beam quality by using this welding method, but for large-sized (≥100mm 2 ) slab laser crystal, this traditional welding method is prone to large voids (≥1mm 2 ), a large area of ​​virtual soldering, and the solder distribution of the soldering layer is uneven. This is mainly due to ...

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Application Information

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IPC IPC(8): H01S3/06H01S3/042H01S3/16H01S3/091
CPCH01S3/042H01S3/0602H01S3/0619H01S3/091H01S3/1643
Inventor 刘磊陈露梁兴波赵鸿唐晓军王超刘洋王文涛王钢吕坤鹏杨雪曹雪峰
Owner 11TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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