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Copper/tin nano composite powder active solder and preparation method thereof

A technology of active solder and composite powder, which is applied in welding equipment, welding/cutting media/materials, welding media, etc., can solve the problems of high temperature resistance connection, slow reaction kinetics, and high connection temperature of chips and electronic devices. Achieve the effects of easy quality control, small thermal-mechanical damage, and low connection temperature

Active Publication Date: 2017-11-17
UNIV OF SCI & TECH BEIJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The advantage of solid-liquid interdiffusion connection is that it usually does not require pressure and the heating temperature is relatively low; its disadvantage is that the reaction kinetics are slow, and the connection process usually takes tens of minutes to obtain a connection joint that does not contain a low-melting point phase.
[0006] From the above analysis, it is known that the existing high temperature resistant electronic packaging technology has defects such as high connection temperature, high connection pressure or long connection time, which cannot meet the high temperature resistance connection needs of the new generation of chips and electronic devices in the future.

Method used

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  • Copper/tin nano composite powder active solder and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] 1) Preparation of raw material powder. Weigh the tin powder (purity 99.9%, particle size 150 mesh) and copper powder (purity 99.9%, particle size 200 mesh) copper and tin powder at a molar ratio of 1:1, and mix them together.

[0026] 2) High-energy ball milling. Put the mixed metal powder prepared in step 1) into a stainless steel ball mill tank together with stainless steel balls at a ball-to-material ratio of 15:1 (mass ratio), cover and seal, and vacuum to 1×10 with a mechanical pump -1 After Pa, close the vacuum valve, fill the tank with argon to 1 atm, close the vacuum valve, repeat the vacuum-filling process 3 times, and then start the ball mill, the ball mill speed is 300 rpm, and the ball mill time is 4 hours.

[0027] 3) Connect, cold press the powder obtained in step 2) into a sheet of solder, the pressure is 300MPa, and the thickness of the solder sheet is 0.6mm. Place the solder sheet between the two copper plates to be connected and fix it with a clamp. Put t...

Embodiment 2

[0030] 1) Preparation of raw material powder. Weigh the tin powder (purity 99.9%, particle size 150 mesh) and copper powder (purity 99.9%, particle size 200 mesh) copper and tin powder at a molar ratio of 2:1 and mix them together.

[0031] 2) High-energy ball milling. Put the mixed metal powder prepared in step 1) into a stainless steel ball mill tank together with stainless steel balls at a ball-to-material ratio of 15:1 (mass ratio), cover and seal, and vacuum to 1×10 with a mechanical pump -1 After Pa, close the vacuum valve, fill the tank with argon to 1 atm, close the vacuum valve, repeat the vacuum-filling process 3 times, then start the ball mill, the ball mill speed is 200 rpm, and the ball mill time is 0.5 hours.

[0032] 3) Connect, cold press the powder obtained in step 2) into a sheet of solder, the pressure is 100MPa, and the thickness of the solder sheet is 0.2mm. Place the solder sheet between the two copper plates to be connected and fix it with a clamp. Put the ...

Embodiment 3

[0035] 1) Preparation of raw material powder. Weigh the tin powder (purity 99.9%, particle size 150 mesh) and copper powder (purity 99.9%, particle size 200 mesh) copper and tin powder at a molar ratio of 3:1, and mix them together.

[0036] 2) High-energy ball milling. Put the mixed metal powder prepared in step 1) into a stainless steel ball mill tank together with stainless steel balls at a ball-to-material ratio of 15:1 (mass ratio), cover and seal, and vacuum to 1×10 with a mechanical pump -1 After Pa, close the vacuum valve, fill the tank with argon to 1 atm, then close the vacuum valve, repeat the vacuum-filling process 3 times, then start the ball mill, the ball mill speed is 400 rpm, and the ball mill time is 8 hours.

[0037] 3) Connect, cold press the powder obtained in step 2) into a sheet of solder, the pressure is 200MPa, and the thickness of the solder sheet is 0.4mm. Place the solder sheet between the two copper plates to be connected and fix it with a clamp. Put ...

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Abstract

The invention discloses copper / tin nano composite powder active solder and a preparation method thereof, and belongs to the technical field of electronic packaging. The copper / tin nano composite powder active solder is formed by mechanical activation compounding of copper and tin, and the molar ratio of the copper to the tin is 1:1-3:1. The particle size of composite powder is tens of to hundreds of microns, and the composite powder is formed by alternately arraying the copper and the tin in a layering mode. The thickness of each layer is tens of to thousands of nanometers. A small amount of copper and tin intermetallic compound can be formed in particles of the composite powder. The mechanical activation preparation method of the composite powder active solder refers to high energy ball milling. According to the high energy ball milling, pure copper powder and pure tin powder are used as raw materials, the molar ratio of the copper powder raw material to the tin powder raw material is 1:1-3:1, vacuum or atmosphere protection is used, and ball milling time is 0.5-8h. The copper / tin nano composite powder active solder and the preparation method thereof have the advantages of being simple in preparation technology, low in connecting temperature and short in connecting time and thus can be used for electronic packaging of a new generation of chips and high-temperature-resistance electron devices of the chips.

Description

Technical field [0001] The invention belongs to the field of electronic packaging and relates to a copper / tin nano composite powder active solder and a preparation method thereof. Background technique [0002] The new generation of semiconductor high-temperature power chips can greatly increase the service temperature of electronic devices, and the demand for high-temperature packaging technology has become more urgent. High-lead solder soldering is a traditional high-temperature packaging technology. However, due to the great harm caused by lead to the environment, lead-containing solders have been completely banned in the field of electronic packaging. Lead-free solder and its connection technology have become the key to new electronic packaging. [0003] Gold-based solder is a kind of high-temperature lead-free solder that has been studied and applied earlier, and the developed systems include Au-Sn, Au-Ge, Au-Si, etc. Compared with the traditional high-lead solder, the gold-ba...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/02B23K35/30B23K35/40
CPCB23K35/0244B23K35/302B23K35/40
Inventor 赵兴科徐守凯寇露露肖宇
Owner UNIV OF SCI & TECH BEIJING
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