Focal plane infrared detector assembly packaging structure integrated with multistage thermoelectricity refrigerator

Abstract

The invention discloses a focal plane infrared detector assembly packaging structure integrated with a multistage thermoelectricity refrigerator. The structure comprises an assembly casing, the multistage thermoelectricity refrigerator, an electrode board, a focal plane module, diaphragms, a getter, a cover board and a window, wherein the pyramid multistage thermoelectricity refrigerator is integrated in an assembly, the casing, the multistage thermoelectricity refrigerator and the electrode board are fixed through filling high heat conduction silver slurry, the focal plane module and the electrode board are fixed through employing low temperature epoxy glue, electric leading out of the focal plane module is realized through a flexible wire, the view field diaphragm and the anti-radiation diaphragm are integrated in the assembly, the view field diaphragm is fixed on the electrode board, the anti-radiation diaphragm is fixed on the middle stage of the pyramid multistage thermoelectricity refrigerator, and laser welding sealing and high vacuum exhaust are carried out after all the parts are assembled. The assembly packaging structure is advantaged in that large-scale focal plane module refrigeration packaging can be realized, the structure is simple, refrigeration temperature is low, and the assembly packaging structure is suitable for packaging of extension wavelength InGaAs and intermediate waves tellurium cadmium focal plane modules.

Description

technical field [0001] The invention relates to a packaging method of a photoelectric detector, in particular to the occasion of low-temperature vacuum packaging of an infrared focal plane detector working at 180K to 250K. Background technique [0002] Extended-wavelength InGaAs focal plane detectors (1.7-2.5 μm) are widely used in aerospace, mineral exploration, precision weapon guidance, infrared alarm and identification, reconnaissance and surveillance and other fields. Limited by sensitivity, infrared detectors generally need to work at low temperatures, and the detectors are usually packaged in a metal Dewar and refrigerated by a refrigerator. Due to the good uniformity and stability of the InGaAs epitaxial material, it has a high detection rate at a working temperature of 180K to 250K. Working in this temperature range can be refrigerated by a thermoelectric cooler and a tube shell. Sealing will greatly simplify the package structure and reduce the package cost. Xu Q...

AI Technical Summary

Problems solved by technology

Xu Qinfei and others reported a thermoelectric cooling ultra-long line InGaAs detector packaging structure, application number: 201310469740.5, using the first-level thermoelectric cooling and nitrogen protection to realize the packaging of conventional wavelength InGaAs focal plane detectors, the structure cooling The temperature is high (above 250K), and it is not suitable for the package of the extended wavelength InGaAs detector in the temperature range of 180K ~ 250K

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