Preparation method of polypropylene material

Abstract

The invention provides a special fiber-reinforced polypropylene material and a preparation method and application thereof. The special fiber-reinforced polypropylene material comprises 50-90 parts of polypropylene, 1.0-2.0 parts of a compatilizer, 0.3-0.5 part of a coupling agent, 0.5-1.0 part of an antioxidant, 0.5-0.8 part of doped silicon dioxide, 0.5-3.0 parts of nano-montmorillonite and 0.5-2.0 parts of a micro-foamed polymer. A twin-screw extruder is adopted to extrude, and the polypropylene material which is low in dielectric constant and excellent in electric breakdown resistance is prepared by means of a special screw combination and a fiber adding position technology. A polypropylene film with a special application is prepared from the material. Meanwhile, plasma treatment is performed on the surface of the film. The film can be applied to special parts in special fields such as military industry and micro-electronic industry.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a fiber-reinforced polypropylene material, a preparation method and an application thereof. Background technique [0002] With the development of VLSI, the interconnection RC delay is getting more and more serious, which seriously restricts the performance of high-speed operation. Due to the continuous shrinking of the thickness of the traditional insulating layer silicon dioxide, the self-capacitance increases and the reliability of the circuit is reduced. In order to To solve this problem, the microelectronics industry will use materials with low dielectric constant and high resistance to electrical breakdown to replace traditional silicon dioxide insulating materials. The dielectric constant of polypropylene is 2.25-2.50 at room temperature (tested at 106Hz), and the cost is low, but it has the problems of low rigidity and poor heat resistance. Therefore,...

AI Technical Summary

Problems solved by technology

The dielectric constant of polypropylene is 2.25-2.50 at room temperature (tested at 106Hz), and the cost is low, but it has the problems of low rigidity and poor heat resistance. Therefore, it is often modified with glass fiber to improve the mechanical properties of the material. Strength and heat resistance, but the elongation of glass fiber reinforced polypropylene is greatly reduced, it is not easy to prepare a thin film, and the dielectric constant of the glass fiber reinforced material also increases to 3.5-40, and the electrical breakdown performance At the same time, it is not suitable for blown film forming, and it is difficult to apply in special fields such as military industry and communication electronics.

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