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High-temperature brazing filler metal for foam silver filling based on metal tin and preparing method of high-temperature brazing filler metal

A technology of high-temperature solder and foamed silver, which is applied in metal processing equipment, metal material coating technology, welding equipment, etc., can solve problems such as inability to achieve fitness, and achieve the effect of good impact resistance and large specific surface area

Inactive Publication Date: 2017-08-18
HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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  • Abstract
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Problems solved by technology

[0008] The main purpose of the present invention is to provide a kind of high-temperature brazing filler metal based on metal tin filling silver foam and its preparation method, which is used to overcome the problem that existing electric mopeds cannot realize fitness

Method used

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  • High-temperature brazing filler metal for foam silver filling based on metal tin and preparing method of high-temperature brazing filler metal
  • High-temperature brazing filler metal for foam silver filling based on metal tin and preparing method of high-temperature brazing filler metal

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Embodiment Construction

[0040] The invention provides a high-temperature solder based on tin-filled foamed silver and a preparation method thereof. The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0041]A method for preparing high-temperature solder based on metal tin filling foamed silver, comprising:

[0042] (1) smelting to obtain silver-aluminum alloy, and cutting into alloy flakes of appropriate size;

[0043] (2) cleaning step (1) processed alloy flakes, removing surface stains and drying;

[0044] (3) Preparing an appropriate proportion of corrosive solution, and obtaining a foamed silver sheet by a dealloying method, the foamed silver sheet has certain pores;

[0045] (4) the foamed silver flake that cleaning step (3) obtains, removes surface stain, and dry stand-by;

[0046] (5) Print solder paste of appropriate size and thickness on the foamed silver sheet by screen printing, and then reflow to obtain a high-temperat...

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Abstract

The invention provides a preparing method for high-temperature brazing filler metal for foam silver filling based on metal tin. The high-temperature brazing filler metal is a metal sheet formed by filling the foam silver with nanoscale pores through the metal tin, wherein the foam silver piece is obtained by corroding a silver-based metal alloy sheet through a de-alloying method. The foam silver is filled with the liquid metal tin under the capillary action, and preparing of a brazing filler metal sheet is achieved. The brazing filler metal sheet is used for welding so that low-temperature (240 DEG C) welding can be achieved, welding points can bear the high-temperature (480 DEG C) service, welding point reliability and weld joint stability are greatly improved, and the preparing method can be widely applied to various high-temperature welding fields.

Description

technical field [0001] The invention belongs to the field of brazing filler metal, which is an interdisciplinary technology of material physics and material processing, in particular a high-temperature brazing filler metal based on metallic tin filled with foamed silver and a preparation method thereof. Background technique [0002] The continuous development of industries such as automobiles and aerospace has made the requirements for high-power semiconductor devices with higher electrical and thermal performance more and more urgent. Wide bandgap semiconductor materials, such as silicon carbide (SiC) and gallium nitride (GaN), can replace silicon (Si) to easily achieve high power density applications at the chip level. It is difficult for Si chips to work at temperatures exceeding 175°C, while SiC chips can work normally in extreme environments exceeding 300°C. Although SiC is theoretically an ideal chip material, it is suitable for the application of high-temperature and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/14B23K35/24C22C21/00C23F1/30C23C2/08
CPCB23K35/0233B23K35/24C22C21/00C23C2/08C23F1/30
Inventor 陈宏涛何军健
Owner HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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