Circuit board production method using immersion gold and electrolytic gold plating combined surface treatment

Abstract

The invention discloses a circuit board production method using immersion gold and electrolytic gold plating combined surface treatment. A substrate is drilled and then subjected to electroless copper deposition panel plating; then the whole copper layer is thickened by pattern plating; then an anti-immersion gold dry film is printed; after exposure and development of the film, a circuit pattern with copper exposed in an open window is formed; immersion gold plating is carried out and the film is stripped off; then an anti-immersion gold dry film is printed; after exposure and development of the film, electrolytic gold plating is carried out and the film is stripped off; the circuit board is subjected to etching, and the exposed copper surface is etched off; an in-process inspection is carried out; solder masking ink is printed and follow-up processes are carried out. The method substantially simplifies the technique and solves the problems of gold infiltration and low consumed time in the prior art. The entire production process has only one etching, so that the entire substrate has the conductive copper surface to complete the electrolytic copper plating before the electrolytic copper plating, thereby reducing the process and improving the quality and production efficiency. According to the invention, the circuit pattern is produced at the same time as an immersion gold surface treatment area, and surface treatment is completed before silk screen and solder masking, so that the process is reduced, the time is saved and the production efficiency of the circuit board is improved.

Description

[0001] 【Technical field】 [0002] The invention relates to a production method of a circuit board with combined surface treatment of immersion gold and electro-gold, belonging to the technical field of printed circuit boards. [0003] 【Background technique】 [0004] The general circuit board production process includes cutting, drilling, copper sinking, full board electroplating, outer layer graphics transfer, graphic electroplating, etching, solder mask, characters, surface treatment, molding, electrical testing, FQC, FQA, packaging, etc. [0005] With the ever-changing electronic products and the multi-functional requirements, when some circuit boards are designed, different areas have different surface treatment requirements. In order to save costs, circuit board designers usually electroplate thick gold of more than 30 microinches locally on the circuit board, while other places only need 1-3 microinches of chemical gold. [0006] The current method of making wire seed boa...

AI Technical Summary

Problems solved by technology

[0006] The current method of making wire seed boards for partial electroplating thick gold surface treatment requires electroplating copper to thicken the production boards after the pattern transfer, and electroplating a layer of anti-corrosion tin layer, and then using strong alkali to dry the photosensitive film. Remove, use a strong oxidizing potion to remove the exposed copper, and finally remove the electroplated anti-corrosion tin layer, so that the substrate forms a substrate with circuits, and then solder resist and solidify to deposit copper. This kind of process is cumbersome and easy to appear. Etching is not clean and other defects, and after the solder mask is cured, it needs to go through the copper sinking process. The long process increases the chance of quality risk, and the time-consuming affects the delivery time.