Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A laminated chip power distribution module and its manufacturing method

A technology for distributing modules and power, which is applied in the electronic field, can solve the problems of large insertion loss, large space occupation, and inconvenient assembly, and achieve the effects of small insertion loss, high installation efficiency, and high reliability

Active Publication Date: 2022-04-29
SHENZHEN ZHENHUA FU ELECTRONICS +1
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The main purpose of the present invention is to provide a laminated chip power distribution module, which aims to solve the problems of traditional power distribution modules such as large space occupation, inconvenient assembly, low isolation and large insertion loss

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A laminated chip power distribution module and its manufacturing method
  • A laminated chip power distribution module and its manufacturing method
  • A laminated chip power distribution module and its manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] In order to make the purpose, technical scheme and advantages of the present invention clearer, the present invention will be further explained in detail with reference to the drawings and examples. It should be understood that the specific embodiments described here are only for explaining the present invention, but not for limiting the present invention.

[0021] It should be noted that when an element is called "fixed" or "set" on another element, it can be directly or indirectly on the other element. When an element is called "connected" to another element, it can be directly connected to another element or indirectly connected to the other element.

[0022] It should also be noted that the terms of left, right, up, down, etc. in the embodiment of the present invention are only relative concepts or refer to the normal use state of the product, and should not be regarded as restrictive.

[0023] Please refer to the attachment. Figure 1 ~ 3 The invention provides a lamina...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a laminated chip power distribution module, which includes an input electrode, an output electrode, an upper cover, a lower cover, and an intermediate layer, and the intermediate layer includes an inner electrode of a bypass capacitor, a power distribution coil, and an inner electrode of a coupling capacitor arranged in layers. , the number of power distribution coils is at least two and connected in parallel with each other; one end of the inner electrode of the bypass capacitor is connected to the common end of the power distribution coil, and the other end is grounded; the common end of the power distribution coil is connected to the input electrode, and the non- The common end is connected to an output electrode; the non-common end of every two parallel power distribution coils is connected to an inner electrode of a coupling capacitor. In the present invention, the inner electrodes of the bypass capacitor, the power distribution coil and the inner electrode of the coupling capacitor are laminated between the upper cover and the lower cover. The overall product is highly integrated, small in size, easy to assemble, good in weldability, and suitable for high-density surface mounting. Small insertion loss, high isolation, excellent phase balance and amplitude balance, which meet both assembly requirements and electrical performance requirements.

Description

Technical field [0001] The invention belongs to the technical field of electronics, in particular to a laminated power distribution module and a manufacturing method thereof. technical background [0002] With the rapid development of electronic equipment in the direction of miniaturization, light weight and integration, the volume of the whole electronic machine and system is getting smaller and smaller, and the installation density of components is getting larger and larger, which requires the corresponding components to develop towards miniaturization. Microwave power distribution module is a component that divides one input signal energy into two or more paths to output equal or unequal energy. Most of the traditional power distribution modules are assembled devices, which are bulky, complicated in installation mode, high in insertion loss and low in isolation. Therefore, a new type of power distribution module needs to be proposed to solve the above problems. Inventive cont...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01P5/16H01P11/00
CPCH01P5/16H01P11/00
Inventor 徐鹏飞王海黄寒寒朱建华刘季超张华良王智会
Owner SHENZHEN ZHENHUA FU ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com