A foam aluminum composite liquid metal thermal interface material

A technology of thermal interface material and liquid metal, which is applied in the direction of heat exchange materials, semiconductor/solid-state device parts, electrical components, etc., can solve the problems of liquid metal side leakage, circuit board short circuit, and large increase in fluidity, etc., to achieve Low production cost, good heat dissipation performance, and simple processing and smelting methods

Active Publication Date: 2018-06-19
NINGBO SYRNMA METAL MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This feature makes the fluidity of liquid metal as a thermal interface material increase greatly with the increase of temperature, and side leakage will occur when liquid metal is used as a thermal interface material, and the circuit board will be short-circuited due to the conductivity of liquid metal

Method used

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  • A foam aluminum composite liquid metal thermal interface material
  • A foam aluminum composite liquid metal thermal interface material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A liquid metal thermal interface material with syntactic aluminum foam for heat dissipation at 80°C. By weight percentage, Zn: 2.3%, Sb: 1.9%, Sn: 8.7%, Zr: 0.6%, Gd: 0.1%, Ru: 0.03%, and the balance is In. The alloy with the above composition was melted in a graphite crucible in an argon-protected vacuum induction melting furnace at 420° C., and homogenized by electromagnetic stirring for 10 minutes. Then, the molten liquid metal is cast into the foamed aluminum for infiltration casting under the action of gravity, and the density of the foamed aluminum is controlled at 12%. The obtained infiltrated ingot was cold-rolled, and the rolling reduction in each pass was 25%. The total thickness after rolling is 0.05 mm. In this embodiment, the melting point of the liquid metal is 84°C. The thermal conductivity of the thermal interface material is 94W / m.K, which is suitable for use as a thermal interface material for heat dissipation at 80°C.

Embodiment 2

[0026] A liquid metal thermal interface material for heat dissipation at 120°C with syntactic aluminum foam. By weight percentage, Zn: 5.3%, Sb: 2.7%, Sn: 9.4%, Zr: 0.6%, Gd: 0.1%, Ru: 0.03%, and the balance is In. The alloy with the above composition was melted in a graphite crucible in an argon-protected vacuum induction melting furnace at 420° C., and homogenized by electromagnetic stirring for 10 minutes. Then the molten liquid metal is poured into foamed aluminum for infiltration casting under the action of gravity, and the density of foamed aluminum is controlled at 26%. The obtained infiltrated ingot was cold-rolled, and the rolling reduction in each pass was 25%. The total thickness after rolling is 0.05 mm. In this embodiment, the melting point of the liquid metal is 124°C. The thermal conductivity of the thermal interface material is 101W / m.K, which is suitable for use as a thermal interface material for heat dissipation at 120°C.

Embodiment 3

[0028] A liquid metal thermal interface material for heat dissipation at 180°C with syntactic aluminum foam. By weight percentage, Zn: 4.6%, Sb: 1.3%, Sn: 15.4%, Zr: 0.5%, Gd: 0.1%, Ru: 0.04%, and the balance is In. The alloy with the above composition was melted in a graphite crucible in an argon-protected vacuum induction melting furnace at 420° C., and homogenized by electromagnetic stirring for 10 minutes. Then the molten liquid metal is poured into foamed aluminum for infiltration casting under the action of gravity, and the density of foamed aluminum is controlled at 28%. The obtained infiltrated ingot was cold-rolled, and the rolling reduction in each pass was 25%. The total thickness after rolling is 0.05mm. In this embodiment, the melting point of the liquid metal is 184°C. The thermal conductivity of the thermal interface material is 96W / m.K, which is suitable for use as a thermal interface material for heat dissipation at 180°C.

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Abstract

The invention discloses a liquid metal thermal interface material composited with aluminum foam, which is made of liquid metal thermal interface material and aluminum foam, and the liquid metal thermal interface material is composed of the following components in weight percentage: Zn: 2.0-6.0% , Sb: 1.0‑3.0%, Sn: 8.0‑16.0%, Zr: 0.3‑0.8%, Gd: 0.1‑0.2%, Ru: 0.02‑0.04%, and the balance is In. Since the thermal conductivity of aluminum is around 237 W / m.K. By adjusting the density of aluminum, the thermal conductivity of the liquid metal thermal interface material can be effectively increased to 90-110W / m.K. Provide a cooling solution at the top of the cooling pyramid for large-scale and effective cooling in extreme environments.

Description

technical field [0001] The invention relates to the field of liquid metal, in particular to a foam aluminum composite liquid metal thermal interface material. Background technique [0002] As we all know, IGBT devices have become the mainstream devices in the development of power semiconductor devices today due to their high input resistance, fast switching speed, low on-state voltage, high blocking voltage, and large current. They are widely used in various AC motors, In the power electronic circuit of frequency converter, switching power supply, lighting circuit, traction drive and other fields. When the IGBT device is working, the heat generated will cause the chip temperature to rise rapidly beyond the maximum allowable IGBT junction temperature. Therefore, the performance of the IGBT will be greatly reduced, and cannot work stably, resulting in performance degradation or failure. Due to the further development of IGBT technology in recent years, the related high-effic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C28/00C22C1/08C22F1/16C09K5/12H01L23/373H01L23/473
CPCH01L23/3736H01L23/473C09K5/12C22C1/08C22C28/00C22F1/16C22C1/081
Inventor 刘亚军曹贺全曹帅郭强吴智鑫
Owner NINGBO SYRNMA METAL MATERIALS CO LTD
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