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Photosensitive composition

A photosensitive composition and compound technology, applied in the direction of organic chemistry, etc., can solve the problems of insufficient sublimation and pollution of α-aminoalkylphenone derivatives

Inactive Publication Date: 2017-05-10
ADEKA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the sublimation properties of the α-aminoalkylphenone derivatives described in Patent Documents 1 and 2 are not low enough to cause contamination of a photomask or a heating furnace due to sublimated products.

Method used

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Examples

Experimental program
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Effect test

manufacture example 1

[0146] [Production Example 1] Production of Compound No.1

[0147] 1.0 eq. of halide 1 was dissolved in 9.0 eq. of dimethyl sulfoxide, 4.0 eq. of potassium carbonate and 1.8 eq. of thiol compound 1 were added, and heated and stirred at 70° C. for 10 hours under a nitrogen atmosphere. After cooling to room temperature, it was neutralized with dilute hydrochloric acid and extracted with ethyl acetate. The solvent was distilled off, and the crude product was recrystallized from methanol: ion-exchanged water = 1:1, and dried to obtain Compound No. 1 of [Chem. 3] (yield 23.2%). Various analyzes were performed, and it was confirmed that the obtained compound was target compound No. 1. The analysis results are shown below.

[0148] Furthermore, in this production example, as the halogen body 1, the halogen body 1 in [Chemical 17], R 1’ and R 2’ Linked to form a morpholine ring, R 3’ and R 4’ is methyl, R 5’ , R 6’ , R 7’ and R 8’ is hydrogen, and X is the halogen form of br...

manufacture example 2

[0149] [Production Example 2] Production of Compound No. 17

[0150] 1.0 eq. of halide 1 was dissolved in 9.0 eq. of dimethyl sulfoxide, 4.0 eq. of potassium carbonate and 1.8 eq. of thiol compound 1 were added, and heated and stirred at 120° C. for 20 hours under a nitrogen atmosphere. Add excess toluene, filter and separate impurities, and cool to 5°C. The precipitated solid was filtered and washed. The obtained solid was dissolved in water, neutralized with dilute hydrochloric acid, and extracted from chloroform. The solvent was distilled off, recrystallized from ethyl acetate, and dried to obtain Compound No. 17 (yield 7.6%). Various analyzes were performed, and it was confirmed that the obtained compound was target compound No. 17. The analysis results are shown below.

[0151] Furthermore, in this production example, as the halogen body 1, the halogen body 1 in [Chemical 17], R 1’ and R 2’ Linked to form a morpholine ring, R 3’ and R 4’ is methyl, R 5’ , R 6’ ,...

Embodiment 1

[0161] [Example 1] Manufacture of alkali-developable photosensitive resin composition No.1

[0162] 54.84 g of SPC-1000 (acrylic resin; manufactured by Showa Denko Co., Ltd.), 12.77 g of Aronix M-450 (multifunctional acrylate; manufactured by Toagosei Co., Ltd.), and 0.57 g of KBE-403 (silane coupling agent; manufactured by Shin-Etsu Silicone Co., Ltd.) were mixed , 3.19 g of cyclohexanone 1% solution and 27.95 g of propylene glycol-1-monomethyl ether-2-acetate of FZ-2122 (surfactant; manufactured by Japan Unicar Co., Ltd.), measure 14.805 g from the mixed solution, add 0.195 g of the compound No. 1 obtained in manufacture example 1 was fully stirred, and the alkali-developable photosensitive resin composition No. 1 which is the photosensitive composition of this invention was obtained.

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PUM

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Abstract

Provided is a photosensitive composition that uses, as a photopolymerization initiator, a compound that is useful as a highly sensitive photopolymerization initiator that is activated by efficiently absorbing near-ultraviolet light of 365nm or the like, has excellent stability and low sublimation. The photosensitive composition includes a photopolymerization initiator (A) comprising a compound represented by general formula (I), and a polymerizable compound (B) including an ethylenically unsaturated bond. In the compound represented by general formula (I), it is preferable that R10 is: a hydrogen atom; a C1-12 alkyl group substituted with a hydroxyl group, a carboxyl group, a halogen atom, a cyano group, or a nitro group; or a non-substituted C1-12 alkyl group.

Description

technical field [0001] The present invention relates to a photosensitive composition containing a photopolymerization initiator and a polymerizable compound having an ethylenically unsaturated bond. Background technique [0002] The photosensitive composition is obtained by adding a photopolymerization initiator to a polymerizable compound having an ethylenically unsaturated bond. Since it can be polymerized and cured by irradiating energy rays (light), it is used for photosensitive printing plates, various A photoresist, etc. [0003] Patent Documents 1 and 2 propose the use of an α-aminoalkylphenone derivative as a photopolymerization initiator used in the photosensitive composition. [0004] However, the sublimation properties of the α-aminoalkylphenone derivatives described in Patent Documents 1 and 2 are not low enough, and they cause contamination of a photomask or a heating furnace due to sublimated products. [0005] prior art literature [0006] patent documents ...

Claims

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Application Information

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IPC IPC(8): C08F2/48C07D295/10
CPCC07D295/108C08F2/48
Inventor 金原有希子田町知也有吉智幸
Owner ADEKA CORP
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