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Treatment process and system for organic silica mud

A technology of treatment system and treatment process, which is applied in the field of organic silicon pulp and slag treatment, can solve the problems of inability to truly achieve harmless treatment, limit the development of the organic silicon industry, and easily generate other pollution sources, so as to achieve high production efficiency and environmental benefits Significant, high economic value effect

Active Publication Date: 2017-05-10
李鹏
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011]The above-mentioned method has complicated process, high treatment cost, small treatment capacity, easy to generate other pollution sources, and cannot truly achieve harmless treatment, which limits the development of the organic silicon industry

Method used

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  • Treatment process and system for organic silica mud

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Experimental program
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Effect test

Embodiment 1

[0054] (1) Hydrolysis of disilane: Add 1 ton of organic silicon slurry and 2 tons of water into the hydrolysis tank 1 for reaction, and the reaction time is 60 minutes.

[0055] (2) Copper chloride leaching: keep the liquid level of the hydrolysis tank stable at about 80%, discharge the slurry of the hydrolysis tank to the stirring reactor, add an appropriate amount of hydrochloric acid, adjust the pH value of the solution to 0.5, the solution temperature is 40°C, and the stirring speed is 100rpm , start stirring and continue to react for 4 hours, take samples to detect the dissolution rate of copper in the slag, and stop the reaction when the leaching rate of copper reaches 99%.

[0056] (3) Pressing and backwashing: pump the slurry after leaching and reaction into the backwashing plate and frame filter press 3, the pressing pressure is 6Mpa, and backwashing with clean water after pressing, when the copper ion contained in the washing water is less than 0.05g / l after testing ...

Embodiment 2

[0060] The parameters of this embodiment are basically the same as those of Embodiment 1, the difference being that 1 ton of organic silicon slurry and 1.5 tons of water were added to the hydrolysis tank 1 for reaction, and the reaction time was 30 minutes.

[0061] In the copper chloride leaching step, the pH value of the solution is 1.5, the solution temperature is 70° C., the stirring speed is 80 rpm, and the stirring reaction time is 8 hours. The final output of sponge copper is 42.21 kg.

Embodiment 3

[0063] The parameters of this embodiment are basically the same as those of Embodiment 1, the difference being that 1 ton of organic silicon slurry and 1 ton of water are added to the hydrolysis tank 1 for reaction, and the reaction time is 10 minutes.

[0064] In the copper chloride leaching step, the leaching rate of copper is 99.5%, the pH value of the solution is controlled at 2, the temperature of the reaction solution is 90° C., the stirring speed is 100 rpm, and the reaction time is 1 hour. In the end, 1 ton of organic silicon slurry slag yields 42.64 kg of sponge copper.

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Abstract

The invention relates to a treatment process for organic silica mud. The treatment process comprises the following steps of: disilane hydrolysis, copper chloride leaching, pressing and backwashing, copper replacement, silicon slag roasting and tail gas treatment. According to the treatment process, hydrogen chloride gas generated by hydrolysis is effectively utilized, so that hydrogen chloride gas realizes zero discharge; a stirring reaction kettle is adopted for stirring and leaching, so that a leaching rate of copper is as high as 99%, copper content of sponge copper is 70% or higher, and iron chloride content is 30% or higher, and therefore, the economical value is increased; hydrolysis residues are roasted through a rotary kiln, so that silicon oxide content is greater than 98%, and therefore, the whole process route is free of wastewater and waste residue discharge, the waste gas is only carbon dioxide, harms on environment are reduced to be the lowest, the products are metal copper and silicon powder, and the economical value is high. Throughout the process, zero discharge of wastewater and waste residues is realized, so that the environmental benefits are remarkable; hydrolysis and leaching are performed under normal pressure at a temperature lower than 90 DEG C, requirements on the material and strength of equipment are not high, and a roasting temperature of the rotary kiln ranges from 500 DEG C to 850 DEG C; and moreover, silicon powder does not contain corrosive hydrogen chloride, and requirements on the material of the rotary kiln are not high.

Description

technical field [0001] The invention relates to a process and equipment for treating organic silicon pulp and slag, belonging to the technical field of organic silicon pulp and slag treatment. Background technique [0002] In the production process of methylchlorosilane, the high-boiling-point by-products of methylchlorosilane are used to carry out wet dust removal on the synthesized methylchlorosilane mixture, resulting in a caramel-colored slurry-like liquid-solid mixture. The main component of this mixture is high boiling matter, mainly composed of 1,2-dimethyltetrachlorodisilane, etc., and contains a small amount of copper, with a total copper content of 1.5-5%. This mixture is referred to as silicone pulp residue. [0003] Organic silicon slurry residue contains a large amount of high-boiling point by-products of methyl chlorosilane, and when it meets water, it will produce hydrogen chloride gas and form acid mist, polluting the environment. At the same time, organic ...

Claims

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Application Information

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IPC IPC(8): B09B3/00B09B5/00C22B7/00C22B15/00C01B33/021
CPCC22B7/006C22B15/0091C01B33/021B09B3/00B09B5/00B09B3/80Y02P10/20
Inventor 李鹏高培贾丽华王玮张国文李建王其虎孙茜孙成富
Owner 李鹏
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