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A kind of LED preparation method with high light efficiency

A high-efficiency, light-emitting layer technology, applied in nanotechnology, semiconductor devices, electrical components, etc. for materials and surface science, can solve problems such as poor anti-static breakdown capability, reduced diode performance, and reduced internal quantum efficiency. Achieve the effects of reducing internal leakage, increasing reverse voltage, and reducing operating speed

Inactive Publication Date: 2019-05-10
中山市天成之星光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In the traditional gallium nitride-based diode epitaxial wafer structure, the dislocation throughout the entire P-N junction is one of the main factors causing the performance degradation of the diode. Such dislocations will cause a decrease in internal quantum efficiency, reverse leakage, antistatic Poor breakdown ability
[0007] The electron blocking layer PAlGaN is indispensable in LED epitaxy. The main function is to use the high energy band of AlGaN to block the electrons from the light emitting layer from overflowing to the P layer, but it also brings many disadvantages.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] h 2 Purify the substrate at high temperature in the environment; H at 1000°C 2 Under the atmosphere, feed 100L / min of H 2 , keep the reaction chamber pressure at 100mbar, and process the substrate for 8min.

[0038] The epitaxial wafer includes a multi-quantum well layer in which a low-temperature buffer layer, a U-type gallium nitride GaN layer, an N-type GaN layer, a barrier layer / well layer / supplementary layer / slope well layer structure are sequentially formed from bottom to top on the substrate , functional layer, light emitting layer and P-type GaN layer.

[0039] Using the chemical vapor deposition method of metal organic compounds, at 550 ° C, the pressure of the reaction chamber is maintained at 300 mbar, and the flow rate of NH is 10000 sccm 3 , 50sccm TMGa, 100L / min H 2 1. Growing a low-temperature buffer layer GaN with a thickness of 20 nm on the substrate.

[0040] Grow a U-type GaN layer in the low-temperature buffer layer GaN: first grow a 2D-type GaN...

Embodiment 2

[0050] h 2 Purify the substrate at high temperature in the environment; H at 1050°C 2 Under the atmosphere, feed 120L / min of H 2 , keep the reaction chamber pressure at 200mbar, and process the substrate for 9 minutes.

[0051] The epitaxial wafer includes a multi-quantum well layer in which a low-temperature buffer layer, a U-type gallium nitride GaN layer, an N-type GaN layer, a barrier layer / well layer / supplementary layer / slope well layer structure are sequentially formed from bottom to top on the substrate , functional layer, light emitting layer and P-type GaN layer.

[0052] Using the chemical vapor deposition method of metal organic compounds, at 570 ° C, the pressure of the reaction chamber is maintained at 450 mbar, and the flow rate of NH is 15000 sccm 3 , 75sccm TMGa, 120L / min H 2 1. Growing a low-temperature buffer layer GaN with a thickness of 20nm-40nm on the substrate.

[0053] Grow a U-type GaN layer in the low-temperature buffer layer GaN: first grow a 2D...

Embodiment 3

[0063] h 2 Purify the substrate at high temperature in the environment; H at 1100°C 2 Under the atmosphere, feed 130L / min of H 2 , keep the reaction chamber pressure at 300mbar, and process the substrate for 10min.

[0064] The epitaxial wafer includes a multi-quantum well layer in which a low-temperature buffer layer, a U-type gallium nitride GaN layer, an N-type GaN layer, a barrier layer / well layer / supplementary layer / slope well layer structure are sequentially formed from bottom to top on the substrate , functional layer, light emitting layer and P-type GaN layer.

[0065] Using the chemical vapor deposition method of metal organic compounds, at 580 ° C, the pressure of the reaction chamber is maintained at 600 mbar, and the flow rate of NH is 20000 sccm 3 , 100sccm TMGa, 130L / min H 2 1. Growing a low-temperature buffer layer GaN with a thickness of 40 nm on the substrate.

[0066] Grow a U-type GaN layer in the low-temperature buffer layer GaN: first grow a 2D-type G...

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Abstract

The invention discloses a preparation method for an LED with high light efficiency. The preparation method can further reduce the loss of an light-emitting area, additionally adopts a supplementing layer to improve growth quality of quantum wells, improves the reverse voltage, reduces electric leakage inside the device, changes forbidden band width of the wells by utilizing an In composition gradually-varied oblique well layer so as to trap more electrons and holes, increases the contact area between the electrons and the holes, increases the light-emitting area, reduces the operating speed of electrons, increases the number of effective electrons in contact with the holes, and improves the light-emitting efficiency of the LED.

Description

Technical field [0001] The invention relates to a method for preparing an LED, in particular to a method for preparing an LED with high light efficiency. Background technique [0002] In recent years, light-emitting diode (Light Emitting Diode, LED) lighting technology, known as "green lighting", has developed rapidly. Compared with traditional lighting sources, white light-emitting diodes not only have low power consumption, long service life, small size, environmental protection, but also have the advantages of good modulation performance and high response sensitivity. On the one hand, white light-emitting diodes have the characteristics of high emission power and safety to human eyes; on the other hand, they have the advantages of fast response, good modulation, no electromagnetic interference, and no need to apply for radio spectrum. [0003] The core part of the light-emitting diode is a chip composed of a P-type semiconductor and an N-type semiconductor. There is a tr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L33/06H01L33/32B82Y30/00
CPCB82Y30/00H01L33/0075H01L33/06H01L33/325
Inventor 梁沛明
Owner 中山市天成之星光电科技有限公司
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