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Surface treatment process for enhancing electrolytic copper foil anti-oxidization performance

A technology of electrolytic copper foil and surface treatment, which is applied in the field of surface treatment of electrolytic copper foil to achieve good application prospects and improve the effect of high temperature oxidation resistance

Active Publication Date: 2017-03-29
SHANDONG JINBAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the high temperature oxidation resistance of electrolytic copper foil needs to be improved urgently

Method used

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  • Surface treatment process for enhancing electrolytic copper foil anti-oxidization performance

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Effect test

Embodiment 1

[0015] A surface treatment process for improving the high-temperature anti-oxidation performance of electrolytic copper foil, comprising the following steps: 1) dissolving complexing agents potassium sodium tartrate, zinc sulfate, additive A and additive B in water respectively, and keeping it clear after mixing to obtain an electroplating solution, Additive A is a mixture of ammonium molybdate, aluminum sulfate, zirconium sulfate and indium sulfate in a mass ratio of 4:2:1:1, additive B is a mixture of sodium thiosulfate and sodium hypophosphite in a mass ratio of 2:1 The resulting mixture, the content of potassium sodium tartrate in the electroplating solution is 50g / L, the content of zinc sulfate is 20g / L, the content of additive A is 6g / L, and the content of additive B is 3g / L; 1. The electrolytic copper foil obtained after solidification is placed in the electroplating solution obtained in step 1) for electroplating. The temperature of the electroplating solution is 45±2°C...

Embodiment 2

[0016] A surface treatment process for improving the high-temperature anti-oxidation performance of electrolytic copper foil, comprising the following steps: 1) dissolving complexing agents potassium sodium tartrate, zinc sulfate, additive A and additive B in water respectively, and keeping it clear after mixing to obtain an electroplating solution, Additive A is a mixture of ammonium molybdate, silver sulfate, zirconium sulfate and sodium vanadate at a mass ratio of 4:2:1:1, and additive B is a mixture of sodium sulfite and potassium dihydrogen phosphate at a mass ratio of 2:1 The mixture, the content of potassium sodium tartrate in the electroplating solution is 60g / L, the content of zinc sulfate is 30g / L, the content of additive A is 10g / L, and the content of additive B is 5g / L; The electrolytic copper foil obtained after melting and curing is placed in the electroplating solution obtained in step 1) for electroplating. The temperature of the electroplating solution is 35±2°...

Embodiment 3

[0018] A surface treatment process for improving the high-temperature anti-oxidation performance of electrolytic copper foil, comprising the following steps: 1) dissolving complexing agents potassium sodium tartrate, zinc sulfate, additive A and additive B in water respectively, and keeping it clear after mixing to obtain an electroplating solution, Additive A is a mixture of sodium tungstate, silver sulfate, aluminum sulfate and sodium vanadate in a mass ratio of 4:2:1:1, additive B is a mixture of sodium thiosulfate and sodium phosphite in a mass ratio of 2:1 The resulting mixture, the content of potassium sodium tartrate in the electroplating solution is 30g / L, the content of zinc sulfate is 10g / L, the content of additive A is 1g / L, and the content of additive B is 0.5g / L; The electrolytic copper foil obtained after washing, roughening, and solidification is placed in the electroplating solution obtained in step 1) for electroplating. Nanoscale zinc alloy coating; 3) The el...

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Abstract

The invention relates to a surface treatment process for enhancing electrolytic copper foil anti-oxidization performance. The surface treatment process comprises the steps of at first dissolving kalio-natrimn tartaricum as complexing agent, zinc sulfate, an additive A and an additive B into water, mixing and regulating the pH value, keeping the solution clarified to obtain an electroplate liquid, and placing an electrolytic copper foil in the electroplate liquid for electroplating. The additive A comprises one or more of ammonium molybdate, zirconium sulfate, aluminum sulfate, silver sulfate, indium sulfate, sodium vanadate and sodium tungstate. The additive B comprises one or more of sodium sulfite, sodium hyposulfite, potassium phosphite, sodium hypophosphite and monopotassium phosphate. The electrolytic copper foil prepared by the surface treatment process for enhancing electrolytic copper foil anti-oxidization performance, can achieve an enhancement of the high temperature anti-oxidization performance that under 260 DEG C, no oxidization occurs for 1 hour.

Description

technical field [0001] The invention relates to a surface treatment process of electrolytic copper foil, in particular to a surface treatment process for improving the high-temperature anti-oxidation performance of electrolytic copper foil, and belongs to the technical field of surface treatment of electrolytic copper foil. Background technique [0002] At present, due to the rapid development of electronic products and high environmental protection requirements, various high-end environmentally friendly halogen-free, lead-free high TG sheets have been developed and applied, which puts forward higher requirements for the high-temperature oxidation resistance of electrolytic copper foil. The high-temperature oxidation resistance of the electrolytic copper foil produced by the existing surface treatment process can maintain the high-temperature oxidation resistance after baking at 210°C for 1 hour, and oxidation will occur when the sample is baked at more than 220°C; this perfo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D7/06C25D3/56
CPCC25D3/565C25D7/0614
Inventor 王海振胡旭日朱琪琪姜晓亮周鸥朱义刚
Owner SHANDONG JINBAO ELECTRONICS
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