A kind of low dielectric constant glass fiber reinforced polypropylene material and preparation method thereof

Abstract

The invention discloses a low dielectric constant glass fiber reinforced polypropylene material and a preparation method thereof, which comprises 60-80 parts of polypropylene, 20-40 parts of glass fiber, 0.5-5 parts of Oxygen agent, 3~4 parts of maleic anhydride grafted polypropylene, 0.5~0.8 parts of doped silica and 0.1~0.3 parts of light stabilizer, in which the glass fiber has a dielectric constant of less than 3.8 and a dielectric loss constant of less than 0.0007, borosilicate glass fiber with a diameter of 4~5 microns. The present invention uses glass fiber with an ultra-low dielectric constant less than 3.8 as a reinforcing agent, and adds a certain amount of doped silica at the same time, so that the prepared polypropylene material has a lower dielectric constant and improves the mechanical strength, and It is easy to process and shape, and can be widely used in the fields of military industry and communication equipment.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a low dielectric constant glass fiber reinforced polypropylene material and a preparation method thereof. Background technique [0002] Low dielectric constant materials or low-K materials (low-K materials) are currently a hot topic in the semiconductor industry. By reducing the dielectric constant of the dielectric material used in the integrated circuit, the leakage current of the integrated circuit can be reduced, the capacitive effect between the wires can be reduced, the heating of the integrated circuit can be reduced, and so on. [0003] With the rapid development of electronic information technology, the integration of VLSI devices is getting higher and higher, and its feature size is continuously shrinking, which causes resistance-capacitance delay to increase, and problems such as signal transmission delay, interference enhancement, and power loss ...

AI Technical Summary

Problems solved by technology

[0004] Polyimide is widely used in the microelectronics industry because of its outstanding low temperature resistance and dielectric properties (dielectric constant 2.9~3.6), such as chip packaging materials, shielding materials, base materials for flexible printed circuit boards, etc., but Its high material cost greatly limits its wide application

Compared with polyimide, the dielectric constant of polypropylene is 2.25~2.50 at room temperature (tested at 106Hz), and the cost is low, but it has the problems of low rigidity and poor heat resistance. Therefore, glass fiber is often used to reinforce it. To improve the mechanical strength and heat resistance of the material, but the dielectric constant of the glass fiber reinforced material also increases to 3.5~40, the power loss in the transmission process is very obvious, it is difficult to apply to communication electronic materials