Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Thermosetting resin composition and prepreg and laminated board manufactured from same

A technology of resin composition and prepreg, which is applied in the direction of synthetic resin layered products, applications, household appliances, etc., and can solve problems such as poor adhesion, low heat resistance, and damage to the dielectric properties of the system

Active Publication Date: 2017-01-18
SHENGYI TECH SUZHOU
View PDF6 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

A large number of studies have shown that although hydrocarbon resins can provide good dielectric properties, due to the flexibility and non-polar carbon chain structure of hydrocarbon resins, hydrocarbon resins have insufficient rigidity, low strength, and poor heat resistance after curing. However, there are still many problems to be solved in practical applications such as low transition temperature and poor adhesion.
For example, in the Chinese invention patent CN10544841B, a combination of hydrocarbon resin and allyl-modified phenolic resin is used to make printed circuit boards. Although the adhesive performance of the resin is improved, the peel strength of the board is improved, but it is still low. And the heat resistance of the system is low
Chinese patent CN104845363A uses hydrocarbon resin, allyl-modified benzoxazine resin and allyl-modified bismaleimide resin composition to make printed circuit boards, which improves heat resistance and peel strength , but because allyl-modified benzoxazine resin and allyl-modified bismaleimide resin will introduce a large number of hydroxyl groups, which will damage the dielectric properties of the system

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Thermosetting resin composition and prepreg and laminated board manufactured from same
  • Thermosetting resin composition and prepreg and laminated board manufactured from same

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0060] Put N-(4-hydroxyphenyl)maleimide (190g, 1mol), phenol (94g, 1mol, M94) and oxalic acid (10g) into the flask equipped with thermometer, condenser and stirrer, mix and stir After uniformity, put it in a constant temperature water bath at 70°C; then, under stirring, add formaldehyde solution (150mL, the ratio of phenol / aldehyde to 1 / 0.8) dropwise into the flask for 0.5 hours; after adding formaldehyde, maintain 70°C The temperature and stirring conditions were reacted for 15 hours; then, the reaction product was dissolved and diluted with 400mL acetone, and then the reaction product was precipitated with 40% methanol aqueous solution; the above dissolution-precipitation operation was repeated 3 to 5 times, and it was filtered, separated, Drying yielded pure maleimide phenolic formaldehyde (P-1).

[0061] Take 100g of maleimide phenolic novolac (P-1) prepared by the above method and 500g of methyl isobutyl ketone solvent and put them in a flask to fully mix and dissolve, de...

Synthetic example 2

[0064] With reference to the method of synthetic example 1, the maleimide ester (B-2) of following structure is obtained:

[0065] ; Among them, Ar is , R is phenyl;

[0066] Among them, n is 1~10, and the ratio of x to y is 0.5:1.

Synthetic example 3

[0068] With reference to the method for synthetic example 1, the maleimide ester (B-3) of following structure is obtained:

[0069] ; Among them, Ar is: , R is maleimidophenyl;

[0070]Among them, n is 1~10, and the ratio of x to y is 0.1:1.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
Login to View More

Abstract

The invention discloses a thermosetting resin composition. The thermosetting resin composition is prepared from a, 10-100 parts of hydrocarbon resin, b, 20-100 parts of maleimide ester, c, 0.1-8 parts of initiator, and d, 10-100 parts of allyl modified polyphenyl ether resin according to the solid weight. Maleimide ester with a multifunctional long chain structure and rigid imide rings is adopted and matched with the flexible hydrocarbon resin to form the thermosetting resin composition, maleimide ester and the hydrocarbon resin mutually act, and finally the thermosetting resin composition and a prepreg and laminated board manufactured from the same and used for a printed circuit have the advantages of excellent dielectric performance, heat resistance, adhesion, flame retardance, bending strength and toughness, high peel strength, low water absorption rate, excellent processing process performance and the like.

Description

technical field [0001] The invention relates to a thermosetting resin composition, a prepreg and a laminate made by using the composition, and belongs to the technical field of electronic materials. Background technique [0002] In recent years, with the continuous advancement of high-speed and high-frequency technologies for information processing and information transmission, higher and higher requirements have been put forward for printed circuit substrate materials in terms of dielectric properties. To put it simply, printed circuit substrate materials need to have lower dielectric constant and dielectric loss tangent to reduce signal delay, distortion and loss during high-speed transmission, as well as interference between signals. Therefore, expect to provide a kind of thermosetting resin composition, the printed circuit board material that uses this thermosetting resin composition to make can show sufficiently low low dielectric constant and low dielectric constant in...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08L47/00C08L71/12C08K7/18C08K3/36B32B15/08B32B27/04B32B27/06B32B27/08B32B27/18B32B33/00
CPCB32B15/08B32B27/08B32B27/18B32B33/00B32B2250/40B32B2260/021B32B2260/04B32B2262/101B32B2270/00B32B2307/306B32B2307/3065B32B2307/546B32B2307/558B32B2307/726B32B2457/08C08L47/00C08L71/126C08L79/085C08L2201/02C08L2201/08C08L2203/20C08L2205/03C08K7/18C08K3/36
Inventor 何继亮崔春梅马建肖升高陈诚罗鹏辉易强储正振
Owner SHENGYI TECH SUZHOU
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com