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Microwave copper-clad plate preparation method capable of keeping low thermal expansion coefficient in three axes at the same time

A low thermal expansion coefficient, shaft retention technology, applied in chemical instruments and methods, lamination, adhesives, etc., can solve the problems of limited adjustable range of dielectric constant, large difference, etc., to improve the lack of rigidity, low production cost, low cost The effect of dielectric loss

Active Publication Date: 2017-01-11
CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, there are still some unsolvable problems in the preparation method of glass fiber cloth tarpaulin. For example, the thermal expansion coefficient on the Z axis is quite different from that on the X and Y axis planes, and the Dk of the commonly used E glass fiber is 7.2, and the dielectric constant can be adjusted. limited

Method used

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  • Microwave copper-clad plate preparation method capable of keeping low thermal expansion coefficient in three axes at the same time
  • Microwave copper-clad plate preparation method capable of keeping low thermal expansion coefficient in three axes at the same time
  • Microwave copper-clad plate preparation method capable of keeping low thermal expansion coefficient in three axes at the same time

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preparation example Construction

[0027] The present invention provides a method for preparing a microwave copper-clad laminate with low thermal expansion coefficient in three axes, wherein the three axes refer to the X, Y, and Z axes of the impregnated dielectric board. The preparation method of microwave copper clad laminate comprises the following steps:

[0028] Step (1), prepare the adhesive sheet, the preparation method of the adhesive sheet is: add appropriate amount of fluororesin to modify the PTFE emulsion, add mixed ceramic powder, reinforcing fiber and a certain amount of surface modifier, dilute with deionized water into different Concentration and viscosity, stir evenly, such as heating and stirring in a high-speed mixer at 20-70°C for 10-60min, the stirring speed is 1000-3000rpm; immerse the PTFE porous membrane in the above-mentioned uniform solution of different concentrations for 10-30s, 2 to 5 times the solution, adjusted to the predetermined thickness. Dry the dipped film at 50-120°C for 2...

Embodiment 1

[0051] (1) According to each component specified in Example 1 in Table 1, add FEP, amorphous SiO in PTFE emulsion 2 and surface modifier F8261, diluted with deionized water to a concentration of 35% solid content, stirred in a high-speed mixer at 20°C for 10min, and the stirring speed was 1000rpm. The solvent is configured into different concentrations of 85%, 70%, 50%, 30%, and 15%, so that the PTFE porous membrane with a thickness of 40 μm and a porosity of 80% is immersed in the above-mentioned solution according to the concentration from high to low, A total of 5 times of dipping for 30s each time. Dry the dipped film at 50°C for 5 minutes to remove moisture, then dry at 200°C for 5 minutes to remove low-temperature volatiles such as dispersants, and finally dry at 370°C for 20 minutes to obtain an adhesive sheet with uniform thickness and smooth surface.

[0052] (2) The preparation method of the microwave copper-clad laminate is as follows: stack five adhesive sheets ob...

Embodiment 2

[0054] (1) according to each component specified in embodiment 2 in table 1 respectively, add PFA, amorphous SiO in PTFE emulsion 2 、Al 2 o 3 , glass microfiber, surface modifier F8261 and AN, diluted with deionized water to a concentration of 40% solid content, stirred in a high-speed mixer at 40°C for 20min, and the stirring speed was 2000rpm. The solvent is configured into different concentrations of 80%, 65%, 40%, and 20%, so that the PTFE porous membrane with a thickness of 40 μm and a porosity of 80% is immersed in the above solutions in order from high to low in concentration. A total of 4 times of immersion in 20s. Dry the dipped film at 80°C for 3 minutes to remove moisture, then dry at 300°C for 3 minutes to remove low-temperature volatiles such as dispersants, and finally dry at 380°C for 15 minutes to obtain an adhesive sheet with uniform thickness and smooth surface.

[0055] (2) The preparation method of the microwave copper-clad laminate is as follows: stack ...

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Abstract

The invention discloses a microwave copper-clad plate preparation method capable of keeping a low thermal expansion coefficient in three axes at the same time. By means of the method, a low thermal expansion coefficient of a dielectric plate can be kept in the X axis, the Y axis and the Z axis at the same time. The method includes the following steps that 1, bonding sheets are prepared, wherein fluororesin is added into PTFE emulsion for modification, and mixed ceramic powder / particles, reinforced fibers and a surface modifier are added; then the mixture is diluted into several parts of bonding sheet solutions with different concentrations with deionized water, and the bonding sheet solutions are stirred to be uniform; PTFE porous films are dipped into the uniform bonding sheet solutions with different concentrations, and dipping sheets are adjusted to have a preset thickness; moisture and low-temperature volatile matter on the dipped porous films are removed, drying is carried out to achieve film formation of the fluororesin, and the uniform-thickness bonding sheets with smooth surfaces are obtained; 2, the bonding sheets obtained in the step 1 are overlapped, the number of layers of the bonding sheets is controlled according to the requirement for the thickness of the copper-clad plate, metal foil is placed on the upper layer and the lower layer, and vacuum lamination is carried out.

Description

technical field [0001] The invention relates to a method for preparing a copper clad laminate, in particular to a method for preparing a microwave copper clad laminate which maintains a low coefficient of thermal expansion in three axes at the same time. Background technique [0002] The technological progress of substrate materials for high-speed, high-frequency, and high-density applications has gradually changed the role of the "interconnection" of the circuit of the copper clad laminate into a "signal transmission line". The PTFE-based microwave copper clad laminate can make its use frequency up to 40GHz, with excellent electrical properties (low dielectric constant, low dielectric loss factor, and very stable in a higher temperature and frequency range), chemical corrosion resistance, heat resistance , wide temperature range and low water absorption, it is an inevitable choice for copper clad laminates under high frequency and high use environment requirements. [0003...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/20B32B27/18B32B37/10B32B37/06C09J127/18C09J11/08C09J11/04B32B27/30B32B15/082
CPCB32B15/082B32B15/20B32B27/18B32B27/304B32B37/06B32B37/10B32B2260/046C08L2205/03C09J11/04C09J11/08C09J127/18C08L27/18C08K3/36C08L29/10C08K13/04C08K7/14C08K2003/2227C08L23/0892C08K2003/2241C08K13/02
Inventor 邹嘉佳赵丹黄钊孙晓伟程明生朱春临王璐
Owner CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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