Preparing method for brazing filler metal high in tin content
A solder and content technology, applied in manufacturing tools, welding equipment, metal processing equipment, etc., can solve the problems of easy brittleness, reduced plasticity, and low Sn content in AgCuZnSn solder, and achieves a simple method, good seam filling, The effect of high tin content
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Embodiment 1
[0012] The solder alloy is BAg25CuZn alloy strip with a thickness of 0.2mm, and the thickness of the tin strip is 0.1mm. After multi-pass rolling by a precision rolling mill, a BAgCuZnSn solder alloy strip with a tin layer thickness of 0.02mm and a solder alloy layer thickness of 0.18mm is formed. According to chemical analysis, the tin content is 8.68%. The BAgCuZnSn solder with this tin content is difficult to process through conventional smelting, casting, extrusion, rolling and other processes. According to DSC analysis, compared with the matrix BAg25CuZn solder, the melting point of the prepared solder is nearly 60°C lower. According to the national standard GB / T 11364-2008 "Test Method for Wettability of Solder", the wettability comparison test of the base solder and the prepared solder was carried out, and 200 mg of the test solder was placed in a 40mm×40mm, 2mm thick In the center of the Q235 carbon steel plate, use FB102 brazing flux to cover the brazing filler metal,...
Embodiment 2
[0014] The solder alloy is BAg30CuZn alloy strip with a thickness of 0.2mm, and the thickness of the tin strip is 0.1mm. After multi-pass rolling by a precision rolling mill, a BAgCuZnSn solder alloy strip with a tin layer thickness of 0.01mm and a solder alloy layer thickness of 0.18mm is formed. According to chemical analysis, the tin content is 8.12%. The BAgCuZnSn solder with this tin content is difficult to process through conventional smelting, casting, extrusion, rolling and other processes. According to DSC analysis, compared with the matrix BAg30CuZn solder, the melting point of the solder prepared by this method is nearly 55°C lower. According to the national standard GB / T 11364-2008 "Solder Wettability Test Method", the matrix solder and the newly prepared solder were subjected to a wettability comparison test, and 200 mg of the test solder was placed in a 40mm×40mm thickness of 2mm In the center of the Q235 carbon steel plate, use FB102 brazing flux to cover the br...
Embodiment 3
[0016] The solder alloy is BAg45CuZn alloy strip with a thickness of 0.2mm, and the thickness of the tin strip is 0.1mm. After multi-pass rolling by a precision rolling mill, a BAgCuZnSn solder alloy strip with a tin layer thickness of 0.03mm and a solder alloy layer thickness of 0.18mm is formed. According to chemical analysis, the tin content is 7.56%. The BAgCuZnSn solder with this tin content is difficult to process through conventional smelting, casting, extrusion, rolling and other processes. According to DSC analysis, compared with the matrix BAg45CuZn solder, the melting point of the prepared solder is nearly 50°C lower. According to the national standard GB / T 11364-2008 "Test Method for Wettability of Solder", the wettability comparison test of the base solder and the prepared solder was carried out, and 200 mg of the test solder was placed in a 40mm×40mm, 2mm thick In the center of the Q235 carbon steel plate, use FB102 brazing flux to cover the brazing filler metal,...
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