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Preparation process for high-strength high-conductivity micro copper wire

A preparation process and high-conductivity technology, which is applied in the field of copper for electrical purposes, can solve the problems of low copper wire strength and reduced electrical conductivity, and achieve the effects of reducing harmful impurities and oxygen content, enhancing electrical conductivity, and increasing surface tension.

Active Publication Date: 2017-01-04
安徽晋源铜业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The main problem of copper wire at present is its low strength. It is necessary to greatly increase its strength by adding alloy elements. For example, although the strength of the Cu-Ni-Si copper alloy material developed in Japan has reached more than 550MPa, the alloy strengthening is often accompanied by A decrease in electrical conductivity, which is the most important performance indicator for copper wire

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] The preparation process of a kind of high-strength and high-conductivity micro-fine copper wire proposed by the present invention comprises the following steps:

[0026] S1. Add electrolytic copper into the smelting furnace, raise the temperature to 1140°C, keep warm and melt completely to obtain copper liquid, and feed nitrogen gas into the copper liquid, the flow rate of nitrogen gas is 0.6m 3 / h, ventilation time is 15min, add compound refining agent simultaneously, described compound refining agent comprises: the calcium fluoride of 15wt%, the cryolite of 1wt%, the sodium fluosilicate of 10wt%, the calcium carbonate of 20wt%, balance It is sodium tetraborate, then heated up to 1220°C, stirred by electromagnetic for 10min, left to stand, and slag removed;

[0027] S2. Add alloying elements to the copper liquid obtained in S1, and detect the copper liquid after melting evenly, which includes by weight percentage: Ti 0.45%, Zr 0.35%, Te 0.07%, La 0.09%, Y 0.03%, Sn 0....

Embodiment 2

[0031] The preparation process of a kind of high-strength and high-conductivity micro-fine copper wire proposed by the present invention comprises the following steps:

[0032] S1. Add electrolytic copper into the smelting furnace, raise the temperature to 1160°C, keep warm and melt completely to obtain copper liquid, and pass argon gas into the copper liquid, the flow rate of argon gas is 0.2m 3 / h, the aeration time is 35min, and a compound refining agent is added at the same time, and the compound refining agent includes: 5wt% calcium fluoride, 5wt% cryolite, 2wt% sodium fluorosilicate, 35wt% calcium carbonate, 1wt% Titanium dioxide, 5wt% silicon dioxide, and sodium tetraborate as the balance, then heated up to 1200 ° C, electromagnetically stirred for 25 minutes, left to stand, and slag removed;

[0033] S2. Add alloying elements to the copper liquid obtained in S1, and detect the copper liquid after melting evenly, which includes by weight percentage: Ti 0.55%, Zr 0.25%, ...

Embodiment 3

[0037] The preparation process of a kind of high-strength and high-conductivity micro-fine copper wire proposed by the present invention comprises the following steps:

[0038] S1. Add electrolytic copper into the smelting furnace, raise the temperature to 1150°C, keep warm and melt completely to obtain molten copper, and inject nitrogen gas into the molten copper with a flow rate of 0.4m 3 / h, the aeration time is 25min, while adding a compound refining agent, the compound refining agent includes: 10wt% calcium fluoride, 3wt% cryolite, 6wt% sodium fluorosilicate, 28wt% calcium carbonate, 5wt% Titanium dioxide, 1wt% silicon dioxide, and sodium tetraborate as the balance, then heated up to 1210°C, electromagnetically stirred for 15 minutes, left to stand, and slag removed;

[0039] S2. Add alloying elements to the copper liquid obtained in S1, and detect the copper liquid after melting evenly, which includes by weight percentage: Ti 0.5%, Zr 0.3%, Te 0.08%, La 0.08%, Y 0.04%, S...

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Abstract

The invention discloses a preparation process for a high-strength high-conductivity micro copper wire. The preparation process comprises the following steps: S1, adding electrolytic copper into a smelting furnace, preserving heat and melting the electrolytic copper completely to obtain molten copper, introducing an inert gas, adding a composite refining agent, standing and slagging; S2, detecting that the molten copper comprises the following components in percentage by weight: 0.45 to 0.55 percent of Ti, 0.25 to 0.35 percent of Zr, 0.07 to 0.09 percent of Te, 0.07 to 0.09 percent of La, 0.03 to 0.05 percent of Y, 0.15 to 0.25 percent of Sn, less than or equal to 0.05 percent of Mg, and the balance of Cu; S3, enabling a crystallizer of a continuous casting machine to extend into the molten copper, and drawing upwards through a drawing roller mechanism to form an oxygen-free copper rod; S4, extruding the oxygen-free copper rod continuously and drawing repeatedly to obtain the high-strength high-conductivity micro copper wire. According to the copper wire which is prepared by the preparation process, the electric conductivity reaches over 95 percent IACS, and moreover, the tensile strength is also over 480 MPa.

Description

technical field [0001] The invention relates to the technical field of electrical copper, in particular to a preparation process of high-strength and high-conductivity fine copper wire. Background technique [0002] With the development of the electrical industry, the market demand for cables, wires, switches and copper wires for power supply and distribution equipment has increased rapidly. The reason why copper wire can attract attention and be promoted is inseparable from its high electrical conductivity and high thermal conductivity. With the development of integrated circuits in the direction of high density, multi-function, miniaturization, and low cost, especially the packaging form is changed from the traditional The change from the ceramic package to the plastic package, the copper wire that matches the plastic package will be very useful. [0003] The main problem of copper wire at present is its low strength. It is necessary to greatly increase its strength by ad...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21C37/04C22C1/06C22C9/00C22F1/08B22D11/111
CPCB21C37/047B22D11/004B22D11/111C22C1/06C22C9/00C22F1/08
Inventor 潘加明
Owner 安徽晋源铜业有限公司
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