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Making method of halogen-free flame retardant copper clad laminate

A production method and flame-retardant technology, which are applied in chemical instruments and methods, adhesive types, epoxy resin adhesives, etc., can solve problems such as low cost, human health damage, and environmental pollution, and achieve good electrical performance, high Effect of Tg value

Inactive Publication Date: 2016-12-21
重庆德凯实业股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But at present, there are still many circuit board industries that use bromine-containing compounds, because brominated flame retardants have excellent flame retardant effects and low cost; when halides burn on fire, they will release a large amount of highly toxic and corrosive hydrogen halides Gas, this gas not only pollutes the environment, but also causes certain damage to human health, and in the presence of bromine and chlorine, hydrocarbons will produce highly toxic substances such as dioxins during incomplete combustion at low temperatures

Method used

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  • Making method of halogen-free flame retardant copper clad laminate
  • Making method of halogen-free flame retardant copper clad laminate
  • Making method of halogen-free flame retardant copper clad laminate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Example 1 Preparation of Halogen-free Flame Retardant Copper Clad Laminate

[0032] 1) Modulation of insulating layer glue formula (parts by weight):

[0033]

[0034] The components were fully mixed for 8 hours, and the gelation time of the glue was 255 seconds.

[0035] 2) Gluing: Glue the glass fiber cloth and dry it in a vertical gluing machine to make a prepreg. The gluing speed is 20m / min. Control parameters: gelation time is 120S, resin content is 40%, fluidity 25%;

[0036] 3) Lamination and pressing: According to the product thickness requirements, control the pressing parameters:

[0037] Vacuum degree: 0.005Mpa;

[0038] Pressure: 500PSI;

[0039] Heating rate: 2°C / min;

[0040] Hot plate temperature: 120~230℃;

[0041] Pressing time: 150min;

[0042] Among them, when the temperature of the hot plate is 230 degrees, the corresponding high pressure is 500PSI, and the operation is about 55min at this time;

[0043] Finally, it passes the board appear...

Embodiment 2

[0044] Example 2 Preparation of Halogen-Free Flame-Retardant Copper Clad Laminate

[0045] 1) Modulation of insulating layer glue formula (parts by weight):

[0046]

[0047]

[0048] The components were fully mixed for 8 hours, and the gelation time of the glue was 255 seconds.

[0049] 2) Gluing: Glue the glass fiber cloth and dry it in a vertical gluing machine to make a prepreg. The gluing speed is 22m / min. Control parameters: gelation time is 120S, resin content is 45%, fluidity 20%;

[0050] 3) Lamination and pressing: According to the product thickness requirements, control the pressing parameters:

[0051] Vacuum degree: 0.005Mpa;

[0052] Pressure: 500PSI;

[0053] Heating rate: 2°C / min;

[0054] Hot plate temperature: 120~230℃;

[0055] Pressing time: 150min;

[0056] Among them, when the temperature of the hot plate is 230 degrees, the corresponding high pressure is 500PSI, and the operation is about 55min at this time;

[0057] Finally, it passes the ...

Embodiment 3

[0058] Example 3 Preparation of Halogen-free Flame Retardant Copper Clad Laminate

[0059] 1) Modulation of insulating layer glue formula (parts by weight):

[0060]

[0061] The components were fully mixed for 8 hours, and the gelation time of the glue was 255 seconds.

[0062] 2) Gluing: Glue the glass fiber cloth and dry it in a vertical gluing machine to make a prepreg. The gluing speed is 22m / min. Control parameters: gelation time is 120S, resin content is 45%, fluidity 20%;

[0063] 3) Lamination and pressing: According to the product thickness requirements, control the pressing parameters:

[0064] Vacuum degree: 0.01Mpa;

[0065] Pressure: 550PSI;

[0066] Heating rate: 2°C / min;

[0067] Hot plate temperature: 120~230℃;

[0068] Pressing time: 150min;

[0069] Among them, when the temperature of the hot plate is 230 degrees, the corresponding high pressure is 550PSI, and it runs for about 60 minutes at this time;

[0070] Finally, it passes the board appeara...

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Abstract

The invention discloses a making method of a halogen-free flame retardant copper clad laminate. The steps include: glue preparation: mixing 50-70 parts by weight of nitrogen-containing epoxy resin, 30-50 parts by weight of phosphorus-containing epoxy resin, 50-75 parts by weight of polyphenylene ether resin, 20-50 parts by weight of a DICY curing agent, 0.05-1 part by weight of a curing agent accelerator, 30-80 parts by weight of inorganic filler, and 200-400 parts by weight of a solvent evenly to prepare a glue solution; gluing; superposition and pressing. The method provided by the invention adopts halogen-free nitrogen-containing epoxy resin and phosphorus-containing epoxy resin as the matrix resin, adds polyphenylene ether resin with high heat resistance and excellent electrical properties, then adds the DICY curing agent, the curing agent accelerator, the inorganic filler and the solvent, and carries out baking, superposition and pressing molding. The pressing molded copper clad laminate has a high Tg value and good electrical properties, and has flame retardant performance up to the V-0 level (UL94 standard).

Description

technical field [0001] The invention relates to a method for manufacturing a halogen-free flame-retardant copper-clad laminate, which belongs to the technical field of copper-clad laminates. Background technique [0002] Substances including lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls and polybrominated diphenyl ethers are no longer allowed to be used in the manufacture of electronic products or their components; Greenpeace ( The greening policy vigorously promoted by GreenPeace at this stage requires all manufacturers to completely exclude brominated flame retardants and polyvinyl chloride from their electronic products, in order to comply with green electronics that are both lead-free and halogen-free. But at present, there are still many circuit board industries that use bromine-containing compounds, because brominated flame retardants have excellent flame retardant effects and low cost; when halides burn on fire, they will release a large amount...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/10B32B37/06B32B27/02B32B17/06B32B15/20B32B15/14B32B15/04C09J163/00C09J171/12C09J11/04
CPCB32B37/10B32B5/02B32B15/04B32B15/14B32B15/20B32B17/061B32B37/06B32B2260/021B32B2260/046B32B2262/101B32B2307/3065B32B2309/02B32B2309/12C08L2201/02C08L2201/22C08L2205/025C08L2205/03C09J11/04C09J163/00C09J171/12C08L63/00C08L71/12C08K2003/2227C08K3/36
Inventor 李洪彬
Owner 重庆德凯实业股份有限公司
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