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Heat conducting pouring sealant material and preparation method thereof

A heat-conducting potting and heat-conducting powder technology, applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of insufficient thermal conductivity and insufficient density, and achieve low density and good thermal conductivity Effect

Inactive Publication Date: 2016-11-09
KUSN ZHONGDI MATERIALS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The thermal conductive potting materials in the prior art have insufficient density and insufficient thermal conductivity

Method used

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  • Heat conducting pouring sealant material and preparation method thereof

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Effect test

preparation example Construction

[0049] The preparation method of the heat-conducting potting adhesive material of the present invention is formed by mixing various raw materials.

[0050] In the above preparation method, the mixing method can be implemented by using a high-speed disperser or a planetary stirring device. Specifically, the rotational speed of mixing by a high-speed disperser can be controlled at 800-3000 rpm, and the mixing time is 30-100 minutes. The speed of mixing with planetary mixing equipment can be controlled at 30-80rpm, and the mixing time is 30-100min.

[0051] In the mixing step, the product can also be vacuum defoamed.

Embodiment 1

[0053] First, the ratio of raw materials. Specifically: 50g of a mixture composed of vinyl silicone oil and hydrogen-containing silicone oil, 50g of vinyl silicone oil, 100g of alumina powder (D 50 35μm), 3g airgel, 0.2g coupling agent, 30g flame retardant.

[0054] Both the alumina powder and the airgel are dried, and then the surface is treated with a coupling agent according to a conventional method. Then, the aluminum oxide powder and the airgel are respectively added into the silicone polymer, stirred in a double planetary mixer for 50-60 minutes, and vacuum degassed to form A component and B component. Finally, mix A / B component 1:1 evenly, pour into the mold, and solidify at room temperature or heat.

Embodiment 2

[0056] First, the ratio of raw materials. Specifically: 50g of a mixture composed of vinyl silicone oil and hydrogen-containing silicone oil, 50g of vinyl silicone oil, 100g of alumina powder (D 50 35μm), 3g glass beads (D 50 65μm), 0.2g coupling agent, 30g flame retardant.

[0057] Both the alumina powder and the airgel are dried, and then the surface is treated with a coupling agent according to a conventional method. Then, the aluminum oxide powder and the airgel are respectively added into the silicone polymer, stirred in a double planetary mixer for 50-60 minutes, and vacuum degassed to form A component and B component. Finally, mix A / B component 1:1 evenly, pour into the mold, and solidify at room temperature or heat.

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Abstract

The invention discloses a heat conducting pouring sealant material and a preparation method thereof. The heat conducting pouring sealant material is prepared from the following raw materials in percentage by weight: 50-55wt% of organosilicon polymer, 40-45wt% of heat conducting powder, 2-5wt% of filler and the balance of auxiliaries. The raw materials of the heat conducting pouring sealant material contain the organosilicon polymer, the heat conducting powder, the filler and the auxiliaries, so that the sealant material has lower density and better heat conductivity and is applicable to requirements of some special places on heat conductivity and light weight.

Description

technical field [0001] The invention relates to the technical field of potting adhesive materials, in particular, to a heat-conducting potting adhesive material and a preparation method thereof. Background technique [0002] Potting glue is used for bonding, sealing, potting and coating protection of electronic components. The potting glue is liquid before it is cured and has fluidity. The viscosity of the glue varies according to the material, performance and production process of the product. Only when the potting glue is completely cured can its use value be realized. After curing, it can play the role of waterproof, moisture-proof, dust-proof, heat-conducting, confidential, anti-corrosion, temperature-resistant, and shock-proof. [0003] The heat conduction potting material in the prior art has insufficient low density and insufficient heat conduction. Contents of the invention [0004] In view of this, one aspect of the present invention is to provide a heat-conduct...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J183/05C09J11/04
CPCC09J183/04C08L2205/025C08L2205/03C09J11/04C08L83/04C08K13/06C08K9/00C08K2003/2227C08K7/20C08K3/36C08K3/04
Inventor 刘伟德蒋峰
Owner KUSN ZHONGDI MATERIALS TECH
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