Nanosized silicon nitride reinforced aluminium-magnesium alloy material for automobile electronic packaging and preparation method of alloy material
A nano-silicon nitride, automotive electronics technology, applied in the field of electronic packaging materials, can solve the problems of alloy material strength, plasticity reduction, unsatisfactory nano-material dispersion in alloys, limited application range, etc. Thermal shock performance, excellent encapsulation effect, stable and long-lasting performance
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[0015] A nano-silicon nitride reinforced aluminum-magnesium alloy material for automotive electronic packaging, the alloy material is made of the following raw materials in parts by weight: 6% magnesium, 4% zinc, 2% copper, 1% yttrium, nickel-coated molybdenum disulfide powder 1%, nano-silicon nitride sol 40%, pore-forming agent 1%, absolute ethanol 0.5, and the balance is aluminum.
[0016] Among them, the nano-silicon nitride sol is prepared by the following method: put dodecyltrimethylammonium bromide into absolute ethanol, stir until it is completely dissolved, add nano-silicon nitride, and disperse it by ultrasonic oscillation for 5 hours to obtain it; The weight ratio of nano-silicon nitride, absolute ethanol and dodecyltrimethylammonium bromide is 1:5:0.1.
[0017] The pore forming agent is one of spherical urea.
[0018] The preparation method of the alloy material comprises the following steps:
[0019] (1) First mix aluminum, magnesium, zinc, copper, yttrium, nicke...
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