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Polyimide-based adhesive, film adhesive, adhesive layer, adhesive sheet, copper-clad laminate, wiring board and its manufacturing method

A technology of polyimide and adhesive materials, which is applied in the fields of adhesives, chemical instruments and methods, and printed circuit manufacturing, and can solve problems such as insufficient dielectric properties and low heat-resistant adhesiveness

Inactive Publication Date: 2016-10-12
ARAKAWA CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the adhesive layer containing such a main ingredient may flow out from the end of the multilayer wiring board in the above step (3), or the heat-resistant adhesiveness and low dielectric properties may be insufficient.

Method used

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  • Polyimide-based adhesive, film adhesive, adhesive layer, adhesive sheet, copper-clad laminate, wiring board and its manufacturing method
  • Polyimide-based adhesive, film adhesive, adhesive layer, adhesive sheet, copper-clad laminate, wiring board and its manufacturing method
  • Polyimide-based adhesive, film adhesive, adhesive layer, adhesive sheet, copper-clad laminate, wiring board and its manufacturing method

Examples

Experimental program
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Embodiment

[0116] Hereinafter, although an Example and a comparative example demonstrate this invention concretely, the scope of this invention is not limited to these examples. In addition, in each example, unless otherwise stated, a part and % are based on weight. It should be noted that the number average molecular weight is a value obtained using a commercially available measuring device ("HLC-8220GPC", manufactured by Tosoh Corporation), and the softening point is a value obtained using a commercially available measuring device ("ARES-2KSTD-FCO -STD", manufactured by Rheometric Scientific Company).

[0117]

manufacture example 1

[0119] 3,3',4,4'-benzophenone tetracarboxylic dianhydride (trade name "BTDA-PF", Ebonick Japan Co., Ltd. Manufacture) 225.00g, cyclohexanone 1046.25g and methylcyclohexane 209.25g, heated to 60°C. Next, 345.93 g of dimer diamine (trade name "PRIAMINE 1075", manufactured by Croda Japan Co., Ltd.) was added, and an imidization reaction was carried out at 130° C. for 12 hours to obtain an acid anhydride group-terminated polyimide ( A1-1) (hereinafter also referred to as (A1-1) component) solution (31.0% of non-volatile content). The molar ratio of the acid component / amine component of this (A1-1) component was 1.08, the number average molecular weight was 8500, and the softening point was 70 degreeC.

manufacture example 2

[0121] 755.63 g of the solution of the above-mentioned (A1-1) component was injected|thrown-in to the reaction container similar to manufacture example 1, and the solvent was distilled off under reduced pressure until the non-volatile matter became 34.4%. Next, 2.76 g of octylamine (trade name "Lipomin 8D", manufactured by Lion Specialty Chemicals Co., Ltd.) was further added as the component (A2), and reacted at 140° C. for 16 hours to obtain a blocked polyimide (1 -1) (hereinafter also referred to as (1-1) component) solution (35.9% of non-volatile content). The (1-1) component had an acid anhydride terminal group / octylamine molar ratio of 1.0, a number average molecular weight of 10,000, and a softening point of 70°C.

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Abstract

The invention relates to Polyimide-based adhesives, film adhesive, adhesive layers, adhesive sheets, copper-clad laminate and wiring board and its manufacturing method. The Polyimide-based adhesive can form the adhesive layer which is low in loss modulus and is excellent in heat-resistance adhesivity and low-dielectric character in a B step. The polyimide-based adhesive includes end-modified polyimide (1), a crosslinker (2), and an orgnaic solvent (3). The end-modified polyimide (1) is a reaction product of anhydride-based polyimide (A1) and a primary monoamine X1-NH2 (X refers to a C1-C22 hydrocarbon group) (A2). The anhydride-based polyimide (A1) is a reaction product of monomer groups (alpha) including aromatic tetra-carboxylic acid anhydride (a1) and dimerized-diamine (a2).

Description

technical field [0001] The present invention relates to a polyimide-based adhesive particularly useful in the manufacture of a multilayer wiring board (MLB: Multi-Layer Board), a film-like adhesive material composed of the adhesive, an adhesive layer obtained therefrom, and an adhesive layer comprising the polyimide adhesive. An adhesive sheet of an adhesive layer, a copper-clad laminate, a printed wiring board, and a method for manufacturing the multilayer wiring board. Background technique [0002] Flexible printed wiring boards (FPWB: Flexible Printed Wiring Board) and printed circuit boards (PCB: Printed Circuit Board) and multilayer wiring boards using the above boards are used in mobile communication devices such as mobile phones and smartphones or their base station devices, servers It is widely used in network-related electronic equipment such as routers and large computers. [0003] In recent years, in these products, in order to transmit and process large-capacity...

Claims

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Application Information

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IPC IPC(8): C09J179/08C09J11/06C09J7/02B32B7/12B32B15/08
CPCB32B7/12B32B15/08B32B2311/12B32B2379/08B32B2457/08C08K5/17C09J7/20C09J11/06C09J179/08C09J7/00C09J7/28H05K1/0298H05K3/4611
Inventor 田崎崇司辻雅之盐谷淳中村太阳
Owner ARAKAWA CHEM IND LTD
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