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Structure and method for reducing in-band noise in multistage power amplifier for mobile communication

A power amplifier and mobile communication technology, which is applied in the direction of improving the amplifier to reduce the impact of noise, etc., to achieve the effects of fast heat dissipation, thermal noise reduction, and reduction of in-band noise

Inactive Publication Date: 2016-07-27
佛山臻智微芯科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the practice and products to reduce in-band noise from the packaging method have not yet appeared

Method used

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  • Structure and method for reducing in-band noise in multistage power amplifier for mobile communication
  • Structure and method for reducing in-band noise in multistage power amplifier for mobile communication
  • Structure and method for reducing in-band noise in multistage power amplifier for mobile communication

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Embodiment Construction

[0019] A preferred embodiment of the present invention, such as Figure 1 to Figure 4 Shown, a structure that reduces the in-band noise in the mobile communication multistage power amplifier. figure 1 Shown is a flip-chip front-end module chip (FlipChipFrontEndModule) with the top layer of plastic packaging material removed as a test object for this test. The front-end module chip (chip) includes three chips (die): a power amplifier chip (die) using gallium arsenide material and heterojunction bipolar transistor (HBT) process, and a power amplifier chip (die) using silicon material and complementary metal oxide semiconductor (CMOS) process controller die (die) and a switcher die (die) using gallium arsenide material, high electron mobility transistor (pHEMT) process. The front-end module chip is soldered on a test board, and the power supply voltage of 3.4V and 4.2V is used to test the chip under the condition of power saturation and 100% duty cycle. Connect a temperature se...

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Abstract

The invention discloses a structure for reducing in-band noise in a multistage power amplifier for mobile communication. The structure comprises a power amplifier chip, a plastic package material, a substrate and a radio shielding cover; the power amplifier chip is welded to the substrate, the portion among the radio shielding cover, the power amplifier chip and the substrate is filled with the plastic package material, a heat conducting material is attached to the top face of the power amplifier chip, and the radio shielding cover covers the heat conducting material and the plastic package material in an attached mode. The plastic package method includes the steps that the power amplifier chip is welded to the substrate, and the heat conducting material is attached to the top face of the power amplifier chip; the plastic package material is used for plastic filling, and the top face of the plastic package material is made to be flush with the top face of the heat conducting material on the power amplifier chip. By means of the packaging method, the radio shielding cover is used as a radiator of the power amplifier chip, the chip can radiate heat faster, heat noise of the device is reduced, and in-band noise is reduced.

Description

technical field [0001] The invention relates to a power amplifier and a design method thereof. Background technique [0002] With the development of mobile terminals, people are more and more accustomed to using mobile terminals to surf the Internet, shop, and socialize. Mobile terminals are increasingly inseparable from people's lives. The power amplifier in the mobile terminal is the main receiving device to ensure the seamless connection between the terminal and the base station, and whether we want to surf the Internet, make a phone call, or send a message, it is all through the base station, so mobile terminal suppliers hope that the power amplifier module can There are quite good performance indicators, such as power-added efficiency, gain or linearity (for linear PAs), etc. Of course, they also hope that the power amplifier has a good performance in reducing in-band noise, because the size of in-band noise has a great impact on duplex communication systems such as mo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03F1/26
CPCH03F1/26
Inventor 黄敬馨章国豪区力翔唐杰林俊明李思臻
Owner 佛山臻智微芯科技有限公司
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