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Integrated liquid-cooling heat dissipation case

A liquid-cooled heat dissipation, integrated technology, applied in the direction of cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., can solve the problem of low heat exchange efficiency, achieve enhanced heat exchange, reduce weight, and reduce equipment cost effect

Active Publication Date: 2016-06-08
沈珂
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These two solutions can only cool and deal with the heat emitted by heat-generating devices with regular heat-dissipating surfaces such as CPU and GPU, but are powerless to other heat-generating devices on the circuit board, such as memory, resistors and other components, so they often need to be combined with air cooling
In addition, since the cooling liquid is not in direct contact with the heat-generating device, there is contact thermal resistance and conduction thermal resistance in the middle, resulting in low heat transfer efficiency

Method used

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  • Integrated liquid-cooling heat dissipation case
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  • Integrated liquid-cooling heat dissipation case

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] like figure 1 As shown, the present invention provides an integral liquid-cooled heat dissipation chassis, including a box body 1, a circuit board 2 and a liquid-cooled heat dissipation system, the box body 1 is a closed space composed of multiple wall panels, and the circuit board 2 Placed in the box 1, the circuit board 2 is provided with a plurality of heating devices 3, the bottom of the box 1 forms a liquid storage tank, and the liquid storage tank is used to store cooling liquid, and the cooling liquid is non-conductive liquid.

[0033] The liquid cooling system includes a pipeline 4, a heat exchanger 8, a pump 7, a filter 6 and a spraying mechanism, the heat exchanger 8, the pump 7, and the filter 6 are all arranged on the pipeline 4, and the filter The device 6 can remove impurities in the cooling liquid, the pump 7 pumps the cooling liquid in the liquid storage tank into the pipeline 4, and the heat exchanger 8 is used to cool down the cooling liquid. Both en...

Embodiment 2

[0038] like figure 2 As shown, the present invention provides an integral liquid-cooled heat dissipation chassis, including a box body 1, a circuit board 2 and a liquid-cooled heat dissipation system, the box body 1 is a closed space composed of multiple wall panels, and the circuit board 2 Placed in the box 1, the circuit board 2 is provided with a plurality of heating devices 3, the bottom of the box 1 forms a liquid storage tank, and the liquid storage tank is used to store cooling liquid, and the cooling liquid is non-conductive liquid.

[0039] The liquid cooling system includes a pipeline 4, a heat exchanger 8, a pump 7, a filter 6 and a spraying mechanism, the heat exchanger 8, the pump 7, and the filter 6 are all arranged on the pipeline 4, and the filter The device 6 can remove impurities in the cooling liquid, the pump 7 pumps the cooling liquid in the liquid storage tank into the pipeline 4, and the heat exchanger 8 is used to cool down the cooling liquid. Both e...

Embodiment 3

[0044] like image 3 As shown, the present invention provides an integral liquid-cooled heat dissipation chassis, including a box body 1, a circuit board 2 and a liquid-cooled heat dissipation system, the box body 1 is a closed space composed of multiple wall panels, and the circuit board 2 Placed in the box 1, the circuit board 2 is provided with a plurality of heating devices 3, the bottom of the box 1 forms a liquid storage tank, the liquid storage tank is used to store cooling liquid, and the liquid storage tank It is an open-top liquid storage tank, and the cooling liquid is a non-conductive liquid.

[0045] The liquid cooling heat dissipation system includes a pipeline 4, a heat exchanger 8, a pump 7, a filter 6 and a spraying mechanism, the pump 7 and the filter 6 are all arranged on the pipeline 4, and the filter 6 can cool the Impurities in the liquid are removed, the pump 7 pumps the cooling liquid in the liquid storage tank into the pipeline 4, the heat exchanger 8...

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PUM

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Abstract

The invention relates to the field of liquid cooling, and provides an integrated liquid-cooling heat dissipation case. The integrated liquid-cooling heat dissipation case comprises a case body, a circuit board and a liquid-cooling heat dissipation system. A closed space composed of a plurality of wall boards is formed in the case body. The circuit board is arranged in the case body, and one or more heat emission devices are arranged on the circuit board. A liquid storage groove is formed in the bottom of the case body and used for storing cooling liquid. The liquid-cooling heat dissipation system comprises a pipeline, a heat dissipation mechanism, a pumping mechanism and a spraying mechanism. The pumping mechanism is used for pumping the cooling liquid in the liquid storage groove into the pipeline, the spraying mechanism is connected to one end of the pipeline and used for spraying the cooling liquid into the case body or directly spraying the cooling liquid to the heat emission devices, and the heat dissipation mechanism is arranged at the position, in front of the spraying mechanism, of the pipeline and used for transferring heat of the cooling liquid to the outside of the case body. By the adoption of the integrated structural design, the integrated liquid-cooling heat dissipation case can be used in hostile environments and is convenient to carry, reasonable in design, light in weight, high in heat exchange capability and low in cost.

Description

technical field [0001] The invention relates to the field of liquid cooling, in particular to an integral liquid cooling and heat dissipation cabinet. Background technique [0002] With the rapid development of modern electronic power technology, the integration of electronic power is getting higher and higher, and the performance is getting better and better. At the same time, it is more and more difficult to dissipate heat. In order to facilitate the management and safe operation of equipment, many electronic and electrical devices are installed in special chassis. In order to ensure the normal operation of the equipment, the heat needs to be exported from the heating element to the environment. For devices with low heat generation, air cooling is usually used for heat dissipation. In more and more cases, air cooling can no longer meet the heat dissipation requirements, and liquid cooling applications are increasing. Compared with air cooling, liquid cooling can directly...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20236H05K7/20927H05K7/20345H05K7/20327
Inventor 沈珂
Owner 沈珂
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