Growth method of gallium nitride on silicon based on graphene and magnetron sputtering aluminum nitride
A magnetron sputtering and growth method technology, applied in the field of electronics, can solve the problems of difficult growth, poor crystal quality, high substrate cost, etc., and achieve the effects of overcoming difficult nucleation, easy nucleation, and high dislocation density
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Embodiment 1
[0052] Example 1: Growth of gallium nitride on a silicon (100) substrate based on graphene and magnetron sputtering aluminum nitride.
[0053] Step 1: Transfer graphene.
[0054] Adopt chemical vapor deposition method, grow the single-layer graphene of 0.34nm on the copper substrate, then place the single-layer graphene in the mixed solution of 1M ferric chloride and 2M hydrochloric acid for 12 hours, remove the metal substrate after finally The single-layer graphene is transferred onto a silicon (100) substrate to obtain a silicon (100) substrate covered with graphene with a thickness of 0.34 nm.
[0055] Step 2: magnetron sputtering aluminum nitride.
[0056] The silicon (100) substrate covered with graphene is placed in a magnetron sputtering system, the pressure of the reaction chamber is 1Pa, nitrogen and argon are introduced into the system for 5 minutes, and aluminum with a purity of 5N is used as the target material, and radio frequency magnetron sputtering is adopted...
Embodiment 2
[0065] Example 2: Growth of gallium nitride on a silicon (111) substrate based on graphene and magnetron sputtering aluminum nitride.
[0066] Step A: Transfer graphene.
[0067] Adopt chemical vapor deposition method, grow the single-layer graphene of 0.34nm on the copper substrate, then place the single-layer graphene in the mixed solution of 1M ferric chloride and 2M hydrochloric acid for 12 hours, remove the metal substrate after finally The single-layer graphene was transferred to a silicon (111) substrate to obtain a silicon (111) substrate covered with graphene with a thickness of 0.34 nm.
[0068] Step B: magnetron sputtering aluminum nitride.
[0069] The silicon (111) substrate covered with graphene is placed in a magnetron sputtering system, the pressure of the reaction chamber is 1Pa, nitrogen and argon are introduced into the system for 5 minutes, and aluminum with a purity of 5N is used as the target material, and radio frequency magnetron sputtering is adopted....
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