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Frit composition, frit paste composition, sealing method and electric device

A technology of glass frit and composition, which is applied in the field of electrical devices, glass frit paste composition, and glass frit composition, and can solve the problems of reduced packaging yield, easy generation of microcracks, and reduced overall strength of packaging glass materials, etc.

Active Publication Date: 2016-06-08
WUHAN TIANMA MICRO ELECTRONICS CO LTD +1
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  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In the prior art, glass frit is often used, mixed and ground with organic binders, solvents and fillers, and then vacuum degassed to obtain packaging glass materials. The fillers are usually single eucryptite, cordierite, etc., these The negative thermal expansion coefficient of the material is small, the strain temperature range is narrow, and microcracks are prone to occur, resulting in a decrease in the overall strength of the packaging glass material and a decrease in the packaging yield

Method used

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  • Frit composition, frit paste composition, sealing method and electric device
  • Frit composition, frit paste composition, sealing method and electric device
  • Frit composition, frit paste composition, sealing method and electric device

Examples

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preparation example Construction

[0065] The preparation method of the filler manganese nitride material of embodiment 1-9 is as follows:

[0066] First weigh manganese powder with a purity of about 99.9%, put it into a tube furnace, and heat up to synthesize Mn in a nitrogen atmosphere. 2 N; according to the value of x, an appropriate proportion of Mn 2 N, Mn powder, A element powder and B element powder are mixed and ground; then the ground mixture is placed in 1×10 -1 In the vacuum environment of Pa (3-4 cycles are sufficient), heat to 850 degrees Celsius, keep warm for 16 hours, and finally cool to room temperature.

[0067] The range of their average bulk thermal expansion coefficients in the temperature range of 0-60° C. was obtained by testing the macroscopic thermal expansion curves of the fillers in Examples 1-9 above. See Table 1 below for specific results.

[0068] Table 1

[0069]

[0070]

[0071] In addition, magnetic analysis (with SQUID superconducting quantum interference magnetometer...

Embodiment 1-4 and comparative example 1-4

[0074] In the glass frit composition of embodiment 1-4, glass frit substrate is P 2 o 5 . In the glass frit compositions of Examples 1-4, the proportions of fillers in the glass frit compositions were 40%, 35%, 30% and 25%, respectively. The frit compositions of Examples 1-4 were prepared by mixing the filler manganese nitride material with the frit substrate in these proportions.

[0075] The glass frit composition of Comparative Examples 1-4, which includes a glass frit substrate and a filler. The glass frit substrate is P 2 o 5 , the filler is eucryptite, and for the glass frit compositions of Comparative Examples 1-4, the proportions of fillers in the glass frit compositions are 40%, 35%, 30% and 25%, respectively.

[0076] The glass frit compositions of the above-mentioned Examples 1-4 and Comparative Examples 1-4 are tested for the coefficient of thermal expansion (CTE) below; specifically, the glass frit compositions are made into small blocks of 5 × 5 × 5 mm, and ...

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Abstract

The invention relates to frit composition, frit paste composition comprising the frit composition, a sealing method adopting the glass frit paste composition and an electric device for sealing with the sealing method. According to the frit composition, a manganese-nitrogen compound which has a specific molecular formula and adopts an anti-perovskite crystal structure is taken as filler and has a negative thermal expansion characteristic in a certain temperature range, the overall thermal expansion coefficient of the frit composition can be well adjusted, accordingly, the overall thermal expansion coefficient of the cured glass frit can approach that of a glass substrate, and the frit composition can be better matched with the glass substrate.

Description

technical field [0001] The present invention relates to the field of glass frit technology, in particular to a glass frit composition, a glass frit paste composition comprising the glass frit composition, a sealing method using the glass frit paste composition, and a sealing method using the frit paste composition Sealed electrical installations. Background technique [0002] As a new type of flat panel display, OLED (Organic Light-Emitting Diode) has the advantages of active light emission, high resolution, fast response, low energy consumption and flexibility, and has attracted more and more attention. [0003] Due to the existence of organic layer materials that are extremely sensitive to water vapor and oxygen in current OLED devices, the lifetime of OLED display devices is greatly reduced. In order to solve this problem, in the prior art, a water-oxygen barrier material is mainly used to isolate the organic layer material of the OLED from the outside world. Among them...

Claims

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Application Information

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IPC IPC(8): C03C8/24
CPCC03C8/24
Inventor 李丹丹
Owner WUHAN TIANMA MICRO ELECTRONICS CO LTD
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