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High-conductivity silver paste and preparation method thereof

A high-conductivity, silver paste technology, used in cable/conductor manufacturing, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., can solve the problems of poor device sensitivity and low conductivity, and achieve good printing and printing. The effect of high conductivity, high conductivity and good adhesion performance

Active Publication Date: 2016-06-01
KUSN HISENSE ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, most of the problems in the application of low-temperature conductive silver paste are mainly due to the low conductivity, which leads to poor device sensitivity.

Method used

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  • High-conductivity silver paste and preparation method thereof
  • High-conductivity silver paste and preparation method thereof
  • High-conductivity silver paste and preparation method thereof

Examples

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Effect test

preparation example Construction

[0030] A kind of preparation method of high conductivity silver paste of the present invention, comprises the steps:

[0031] Preparation of organic vehicle: put the polymer resin and solvent in proportion to the stirring tank, and stir for several hours to obtain the organic vehicle. For example, the polymer resin and the solvent are put into a stirred tank according to the mass ratio, and stirred at a high speed of 60-80° C. for 4-6 hours to obtain an organic vehicle.

[0032] Preparation of high-conductivity silver paste: Stir and mix the additives and additives with the organic vehicle in proportion, then add metal silver powder and stir and mix to obtain a mixture, grind and roll the mixture until the dynamic viscosity at room temperature is 15000-50000 centipoise , to obtain the highly conductive silver paste. For example, mix the additives and auxiliary agents with the organic carrier at a high speed for 1 hour according to the mass ratio, then add metal silver powder ...

Embodiment 1

[0035] A low-temperature curing high-conductivity silver paste, its components and mass percentages are as follows:

[0036] Flake silver powder with an average particle size of 15 μm: 41.6%;

[0037] Spherical silver powder with an average particle size of 0.8 μm: 16.9%;

[0038] Nano-silver powder with an average particle size of 10nm: 6.5%;

[0039] Thermoplastic bisphenol A epoxy resin: 9%;

[0040] Isophorone: 15%;

[0041] DBE mixed esters: 7%

[0042] Conductive graphite: 2%

[0043] Hydrogenated castor oil: 0.7%;

[0044] Titanate coupling agent: 0.8%;

[0045] Silicone defoamer: 0.5%.

[0046] The preparation method of above-mentioned high conductivity silver paste is as follows:

[0047] Step 1: Add 15g of isophorone and 7g of DBE mixed ester into a mixing vessel, then add 9g of thermoplastic bisphenol A epoxy resin, stir in a constant temperature water bath at 60-80°C, and stir at 1000RPM for 4.5h to obtain an organic vehicle.

[0048] Step 2, put 2g of con...

Embodiment 2

[0050] A low-temperature curing high-conductivity silver paste, its components and mass percentages are as follows:

[0051] Flake silver powder with an average particle size of 10 μm: 44.8%;

[0052] Spherical silver powder with an average particle size of 0.5 μm: 18.2%

[0053] Nano silver powder with an average particle size of 15nm: 7%;

[0054] Thermoplastic bisphenol A epoxy resin: 5%;

[0055]Thermoplastic vinyl resin: 3%;

[0056] Isophorone: 10%;

[0057] Diethylene glycol ethyl ether butyrate: 8%;

[0058] Conductive graphite: 1.5%;

[0059] Ethyl cellulose: 1.2%;

[0060] Titanate coupling agent: 0.8%;

[0061] Silicone defoamer: 0.5%.

[0062] The preparation method of above-mentioned silver paste is as follows:

[0063] Step 1: Add 10g of isophorone and 8g of diethylene glycol ethyl ether butyrate into the mixing container, then add 5g of thermoplastic bisphenol A epoxy resin, 3g of thermoplastic vinyl acetate resin, and constant temperature water bath 60...

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Abstract

The invention provides a high-conductivity silver paste and a preparation method thereof. The high-conductivity silver paste comprises metal silver powder, wherein the metal silver powder is a mixture of micro-order sheet-shaped silver powder, submicron-order spherical silver powder and nanometer silver powder. The high-conductivity silver paste has the advantages that silver powders with different grain sizes and morphological structures are fully utilized and mutually matched, so that the silver powder can form a more compact status on the structure, and the low-temperature sintered nanometer silver powder is added to be further connected with the conductive silver powder; after mixing the silver paste with macromolecule resin, a solvent, an additive and an assistant agent, the paste can acquire relatively high conductivity under a condition of low-temperature curing (less than or equal to 150 DEG C); and meanwhile, the paste has favorable printing adaptability and favorable attachment performance, and can be applied to the fields of a printed conductive circuit, a radio frequency identification (RFID) label antenna and the like.

Description

technical field [0001] The invention relates to the field of conductive silver paste, in particular to a highly conductive silver paste and a preparation method thereof. Background technique [0002] With the development of the printed electronics industry, the demand for membrane switches, flexible printed circuit boards, electromagnetic shielding, and radio frequency identification systems has increased rapidly, and the development and application of conductive silver paste, as a functional material for preparing such electronic components, has been greatly affected. received widespread attention. [0003] Low-temperature curing conductive silver paste refers to silver paste with a curing temperature in the range of 80-200°C, which can be prepared on plastic or flexible substrates by printing. As a conductive material, silver paste should have excellent electrical conductivity and adhesion after curing. For conductive silver paste, silver powder as the main conductive me...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B13/00
CPCH01B1/22H01B13/00
Inventor 徐国强黄耀鹏周徐徐海生
Owner KUSN HISENSE ELECTRONICS
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