Method for achieving metal-ceramic soldered connections

Abstract

The invention relates to a method for producing a material-fit metal-ceramic welding connection of an uncoated ceramic body (1) and a metal part (2, 3) by means of a metal solder (4), characterized in that the method has the following steps: Choose a metal piece with a 50% share of oxophilic elements (2, 3); choose a ceramic body (1) that is at least 80% composed of alumina, zirconia, silicon oxide or a mixture thereof; choose an inactive, eutectic or close to eutectic solder (4); constitute a structure with a ceramic body (1) and metal parts (2, 3), their surfaces form a gap with each other, and the solder is brought into the gap or near the gap; The structure is placed in a furnace and a vacuum is formed around the structure; the furnace is heated to a soldering temperature T greater than the liquidus temperature (TL) of the solder (4); the soldering temperature is maintained for a soldering duration (Δt). The invention also relates to a connection of this type and to a ceramic tube as well as to a high temperature sensor with such a connection.

Description

technical field [0001] The invention relates to a metal-ceramic welding connection method for materially matching uncoated ceramic bodies and metal parts using metal solder to make the coefficients of thermal expansion compatible with each other; the invention also relates to a metal-ceramic welding connection, the metal - The ceramic solder connection has a space between the surface of the uncoated ceramic body and the surface of the metal part, the space is at least partially filled with solder; the invention also relates to a method for insulating and thermally insulating electrical leads at high temperatures Ground laying to the indoor connection device. Background technique [0002] In some technical fields, it is necessary to connect ceramic bodies and metal parts by welding process. Especially in the field of miniaturized components, such as sensor sockets for various applications, such metal-ceramic solder connections are of great importance. [0003] exist Figure...

AI Technical Summary

Problems solved by technology

And in order to reach the high soldering temperature of active solder, high energy consumption is unavoidable

[0015] Since the ceramic body is not coated when active solder is used, the capillary gap between the ceramic surface and the surface of the steel metal part is not completely filled with active solder, so this solder connection has the form of a fillet weld, which is useful, for example, in The processing described here is unfavorable

Active solders are not suitable for capillary soldering, since the active components may be exhausted in the capillary before the solder has fully penetrated, and thus the gap between the ceramic body and the metal part cannot be completely bonded materially

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