Mount for a component, component and method for producing a mount or a component

A technology of carriers and devices, which is applied in the fields of carriers and devices for devices and for manufacturing carriers or devices, can solve problems such as insufficient mechanical stability, and achieve the effects of simplified manufacturing and high mechanical loadability

Active Publication Date: 2018-04-17
OSRAM OPTO SEMICONDUCTORS GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Components comprising multilayer carriers often have insufficient mechanical stability due to poor adhesion between mutually adjoining constituent parts of the layers or carrier

Method used

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  • Mount for a component, component and method for producing a mount or a component
  • Mount for a component, component and method for producing a mount or a component
  • Mount for a component, component and method for producing a mount or a component

Examples

Experimental program
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Embodiment Construction

[0039] exist Figure 1A A composite structure 200 is provided, which can be a wafer composite 200, such as a semi-finished wafer composite 200, to manufacture a carrier or a device. The composite structure 200 can also be an auxiliary carrier on which the carrier is produced. The composite structure 200 has a first connection layer 410 and a second connection layer 420 on its surface on the same side. The connection layers 410 and 420 are spaced apart from each other in the lateral direction by the intermediate region 40 . The connection layers 410 and 420 are suitably formed of a conductive material. different from Figure 1A , the composite structure 200 can have a plurality of first connection layers 410 and / or a plurality of second connection layers 420 .

[0040] exist Figure 1B The molded body composite 50 is formed on the composite structure 200 in order to form the carrier 10 . The shaped body composite 50 has a plurality of reinforcing fibers 52 embedded in a m...

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PUM

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Abstract

A mount (10) and an optoelectronic component (100) with the mount (10) are provided, wherein the mount (10) comprises a moulding (5), at least one through-contact (41, 42) and a plurality of reinforcing fibres (52), wherein the moulding (5) is formed from an electrically insulating moulding material (53), the through-contact (41, 42) is formed from an electrically conductive material, and the reinforcing fibres (52) produce a mechanical connection between the moulding (5) and the through-contact (41, 42) by the reinforcing fibres (52) being arranged in certain regions of the moulding (5) and arranged in certain regions of the through-contact (41, 42). A method for producing a mount or a component with such a mount is also provided.

Description

technical field [0001] The invention relates to a carrier for a device, a carrier and a method for producing a carrier or a device. Background technique [0002] Components comprising a multilayer carrier generally have insufficient mechanical stability due to poor adhesion between mutually adjoining constituent parts of the layers or carrier. Contents of the invention [0003] An object is to provide a carrier and a component with high mechanical stability. Furthermore, a cost-effective method for producing a carrier for a component or for producing a component comprising such a carrier is proposed. [0004] In accordance with at least one embodiment of a carrier for an optoelectronic component, the carrier has a shaped body and at least one via. The molded body consists in particular of an electrically insulating molded body material, for example of plastic, for example of a castable polymer such as resin, epoxy or silicone. The vias are formed in particular from an e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/62H01L33/56
CPCH01L33/44H01L33/486H01L33/52H01L33/56H01L33/62H01L2933/0033H01L2933/0066
Inventor 卢茨·赫佩尔马蒂亚斯·扎巴蒂尔诺温·文马尔姆
Owner OSRAM OPTO SEMICONDUCTORS GMBH
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