High-temperature-resistant silver-coated and nickel-coated copper conductive powder of core-shell structure and preparation method thereof

Abstract

The invention relates to high-temperature-resistant silver-coated and nickel-coated copper conductive powder of a core-shell structure and a preparation method thereof. The structure of silver-coated and nickel-coated copper particles has three layers, namely, the copper core layer, the nickel middle layer and the silver outmost layer. The preparation process includes the four steps of firstly, preprocessing copper powder; secondly, wrapping the surfaces of the copper particles by nickel; thirdly, wrapping the surfaces of the nickel-coated copper particles with silver; fourthly, processing the silver-coated and nickel-coated copper particles. The prepared silver-coated and nickel-coated copper conductive powder of the core-shell structure has excellent high-temperature-resistant oxidation performance and conductivity, can completely or partly replace silver powder, and is wide in application range.

Description

technical field [0001] The invention relates to a high-temperature-resistant silver-coated nickel-coated copper conductive powder with a core-shell structure and a preparation method thereof, belonging to the technical fields of electronic materials, functional materials and powder materials. Background technique [0002] Today's society is an era of rapid development of the information industry, and electronic products, as one of the main forces, are developing rapidly, and electronic paste plays a vital role as an important part of electronic products. The preparation of conductive phase powder is the most critical part of the electronic paste preparation technology. It determines the final conductive properties of the paste and has a significant impact on the physical and mechanical properties of the final cured film. At present, the conductive phases on the market are mainly divided into two categories: noble metal powders such as platinum, palladium, gold, and silver, ...

AI Technical Summary

Problems solved by technology

[0006] In the current field of electronic paste, silver-coated copper powder cannot completely replace pure silver powder. This is mainly because the prepared silver-coated copper powder is not resistant to high temperature, and it is easy to oxidize in medium and high temperature applications, resulting in a decrease in powder performance.

[0007] In addition, the prior art CN104625046A discloses a method for manufacturing micro- and nano-composite metal spherical powders with a core-shell structure. The composite metal with a core-shell structure spherical powder includes: 1) There are two or two kinds of metals in a certain temperature range in a liquid state. Metals in the above incompatible solution phases, including: iron or iron-based alloys) / copper or copper-based alloys, iron or iron-based alloys / silver or silver-based alloys, cobalt or cobalt-based alloys / silver or silver-based alloys, nickel or nickel base alloy / silver or silver base alloy, tungsten or tungsten base alloy / copper or copper base alloy, tungsten or tungsten base alloy / silver or silver base alloy, tungsten carbide / copper or copper base alloy, tungsten carbide / silver or silver base alloy , iron or iron-based alloy / bismuth or bismuth-based alloy, cobalt or cobalt-based alloy / bismuth or bismuth-based alloy; In the temperature range, there are metals that coexist in liquid and solid phases, including: silver or silver-based alloy / copper or copper-based alloy, aluminum or aluminum-based alloy / silicon or silicon-based alloy, tin or tin-based alloy / bismuth or bismuth-based alloy, Copper or copper-based alloys / bismuth or bismuth-based alloys, cobalt or cobalt-based alloys / copper or copper-based alloys, gold or gold-based alloys / copper or copper-based alloys, but the preparation process is too complicated to be industrially applied

[0008] So far, there is no report on conductive powder with a new structure of silver-coated nickel-coated copper

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