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Transparent conductive film and method for producing same

A technology of transparent conductive film and manufacturing method, which is applied in the direction of cable/conductor manufacturing, conductive layer on insulating carrier, circuit, etc., and can solve the problems of glass substrate flexibility, poor processability, and inability to use

Active Publication Date: 2016-04-13
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the other hand, the flexibility and workability of glass substrates are poor, and there are cases where they cannot be used depending on the application.

Method used

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  • Transparent conductive film and method for producing same
  • Transparent conductive film and method for producing same
  • Transparent conductive film and method for producing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0115] (formation of undercoat layer)

[0116] A thermosetting resin composition containing a melamine resin: an alkyd resin: an organosilane condensate at a weight ratio of 2:2:1 in terms of solid content was diluted with methyl ethyl ketone so that the solid content concentration was 8% by weight. The obtained diluted composition was coated on one main surface of a polymer film substrate made of a 50 μm thick PET film (manufactured by Mitsubishi Plastics, trade name “DIAFOIL”), and cured by heating at 150° C. for 2 minutes to form a film with a thickness of 35 nm. organic undercoating. The surface roughness of the formed organic undercoat layer was measured by AFM (manufactured by Seiko Instruments, "SPI3800"), and Ra was 0.5 nm.

[0117] (Formation of transparent conductive layer)

[0118] The polymer film base material that will be formed with above-mentioned organic undercoat is arranged in vacuum sputtering device, so that ultimate vacuum degree is 0.9 * 10 -4 The Pa ...

Embodiment 2

[0120] A transparent conductive layer and a transparent conductive film were produced in the same manner as in Example 1, except that a sintered body of 10% by weight tin oxide and 90% by weight indium oxide was used as a target to form a single-layer transparent conductive layer with a thickness of 25 nm.

Embodiment 3

[0122] In addition to setting the ultimate vacuum degree in the degassing process of the membrane to 2.0×10 -4 Except Pa, it carried out similarly to Example 2, and produced the transparent conductive layer and transparent conductive film.

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Abstract

Provided is a transparent conductive film with which low resistance characteristics in a transparent conductive layer can be realized. The present invention is a transparent conductive film provided with a polymer film substrate and a transparent conductive layer formed on at least one side of the polymer film substrate by means of a sputtering method that uses a sputtering gas including argon, wherein the amount of argon atoms in the transparent conductive layer is 0.24 atomic% or less, the amount of hydrogen atoms in the transparent conductive layer is 13*1020 atoms / cm3 or less, and the specific resistance of the transparent conductive layer is between 1.1*10-4 Omega cm and 2.8*10-4 Omega * cm, inclusive.

Description

technical field [0001] The present invention relates to a transparent conductive film and a manufacturing method thereof. Background technique [0002] Conventionally, a so-called conductive glass in which an ITO film (indium-tin composite oxide film) is formed on a glass substrate has been widely known as a transparent conductive film. On the other hand, glass substrates are poor in flexibility and workability, and may not be usable depending on the application. Therefore, in recent years, due to the advantages of not only excellent flexibility and processability, but also excellent impact resistance and light weight, various polymer film bases such as polyethylene terephthalate films have been proposed. The transparent conductive film of ITO film is formed on the material. [0003] For transparent conductive materials represented by touch panels, properties such as high transparency, high transmission, and high durability are required. As a measure for improving the tra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/08B32B9/00C23C14/35H01B5/14H01B13/00
CPCB32B9/00G06F3/041C23C14/024C23C14/564C23C14/086C23C14/5806G06F2203/04103C23C14/34C23C14/35H01B5/14C23C14/562G06F3/045
Inventor 藤野望梨木智刚加藤大贵待永广宣佐佐和明上田惠梨松田知也
Owner NITTO DENKO CORP
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