Manufacturing method of gold and silver double-color pattern crystal standing table
A production method and pattern technology, which are applied in special decorative structures, metal material coating processes, and processes for producing decorative surface effects, etc., can solve problems such as monotony and lack of three-dimensional effects, and achieve improved three-dimensional sense and appearance fluctuation. Small, reproducible results
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Embodiment 1
[0022] After cleaning a circular crystal table, magnetron sputtering a layer of 200nm thick chrome-copper seed layer, wherein the chromium layer is 50nm thick, and the copper layer is 150nm thick; spin-coat a A layer of photoresist with a thickness of 50 μm covers the first mask plate with fine patterns, and selectively lithography the central area of the table to expose the first mask pattern. It should be noted that the area of the central area is based on the first The area selection of pattern in the mask plate; Electroplate silver on the window of the first mask pattern, wherein the electrolytic solution of silver plating comprises silver sulfite 30g / L, sodium thiosulfate 150g / L, sodium sulfite 20g / L, lemon Acid 35g / L, succinimide 40g / L, nicotinic acid 5g / L, the pH of the electroplating solution is 5, and the current density is 0.3A / dm 2 After the electroplating is completed, the thickness of the silver layer obtained is 55 μm, and the top of the silver layer is frost...
Embodiment 2
[0025] After cleaning an oval crystal table, magnetron sputtering a layer of 200nm thick chrome-copper seed layer, wherein the chromium layer is 70nm thick, and the copper layer is 130nm thick; spin-coat a A layer of photoresist with a thickness of 50 μm covers the first mask plate with fine patterns, and selectively lithography the central area of the table to expose the first mask pattern. It should be noted that the area of the central area is based on the first The area selection of pattern in the mask plate; Electroplating silver on the window of the first mask pattern, wherein the electrolyte of electroplating silver comprises silver sulfite 18g / L, sodium thiosulfate 100g / L, sodium sulfite 10g / L, lemon Acid 20g / L, succinimide 20g / L, nicotinic acid 1g / L, the pH of the electroplating solution is 6.1, and the current density is 0.3A / dm 2 . After the electroplating is completed, the thickness of the silver layer obtained is 52 μm, and the top of the silver layer is fros...
Embodiment 3
[0028] After cleaning a square crystal table, magnetron sputtering a layer of 200nm thick chrome-copper seed layer, wherein the chromium layer is 50nm thick, and the copper layer is 150nm thick; spin coat a layer on the table with the sputtered seed layer The photoresist with a thickness of 50 μm covers the first mask plate with a fine pattern, and selectively photolithography is carried out in the central area of the table to expose the first mask pattern. It should be noted that the area of the central area depends on the size of the first mask Area selection of patterns in the stencil; electroplating silver on the window of the first mask pattern, wherein the electrolyte for electroplating silver includes silver sulfite 22g / L, sodium thiosulfate 132g / L, sodium sulfite 18g / L, citric acid 30g / L, 30g / L succinimide, 4g / L nicotinic acid, the pH of the electroplating solution is 6.4, and the current density is 0.3A / dm. After the electroplating is completed, the thickness of t...
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