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Novel organic siloxane polymer material for electronic packaging

A technology of siloxane and polysiloxane, which is applied in the field of new organosiloxane polymer materials, can solve problems such as difficult to use electronic packaging products, reduce material transparency, etc., and achieve improved mechanical properties, improved mechanical properties, and excellent strength and elastic effect

Active Publication Date: 2016-02-24
江苏矽时代材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, adding fillers will reduce the transparency of the material, making it difficult to be used in electronic packaging products that require optical transparency

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Prepare various raw materials for the polysiloxane composition of the present invention, wherein the viscosity of the hydroxyl-terminated polydimethylsiloxane at 25°C is 12500mPa·s, and the polymethylphenylsiloxane containing vinyl groups has a viscosity of 12500mPa·s at 25°C. The viscosity at 20000mPa·s, the mass content of side chain vinyl is 7%, the mass content of phenyl is 2%, and the silane or siloxane containing at least two alkoxy groups is methyltrimethoxysilane, containing The mass content of hydrogen in the hydrogen silicone oil is 1%, the condensation catalyst is a mixture of stannous octoate and diisopropoxytitanium bis(ethyl acetoacetate) chelate with a ratio of 1:1, and the platinum catalyst It is chloroplatinic acid, and its consumption is 50ppm of composition, and curing inhibitor is 2-methyl-3-butynyl-2-alcohol, and white carbon black is fumed white carbon black, and its specific surface area is 220cm 3 / g, the mass content in the whole composition is ...

Embodiment 2

[0025] Prepare various raw materials for the polysiloxane composition of the present invention, wherein the viscosity of the hydroxyl-terminated polydimethylsiloxane at 25°C is 12500mPa·s, and the polymethylphenylsiloxane containing vinyl groups has a viscosity of 12500mPa·s at 25°C. The viscosity at 20000mPa·s, the mass content of side chain vinyl is 5%, the mass content of phenyl is 2%, and the silane or siloxane containing at least two alkoxy groups is methyltrimethoxysilane, containing The mass content of hydrogen in the hydrogen silicone oil is 1%, the condensation catalyst is a mixture of stannous octoate and diisopropoxytitanium bis(ethyl acetoacetate) chelate with a ratio of 1:1, and the platinum catalyst It is chloroplatinic acid, and its consumption is 50ppm of composition, and curing inhibitor is 2-methyl-3-butynyl-2-alcohol, and white carbon black is fumed white carbon black, and its specific surface area is 220cm 3 / g, the mass content in the whole composition is ...

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Abstract

The invention relates to an organic siloxane polymer material for electronic packaging. The organic siloxane polymer material comprises hydroxy-terminated polydimethylsiloxane, silane or siloxane containing at least two alkoxy groups, poly(methylphenylsiloxane) containing vinyl groups, hydrogen-containing silicone oil, a condensation catalyst, a platinum catalyst, a curing inhibitor and white carbon black, wherein the vinyl groups in poly(methylphenylsiloxane) are located at an end group and a side chain, and the mass content of the side-chain vinyl group is 3%-10% on the basis of the mass of the component. The organic siloxane polymer material can be applied to the field of electronic packaging and has the characteristics of good mechanical properties, high mechanical strength and excellent transparency.

Description

Technical field [0001] The invention involves a new type of silicone polymer material for electronic packaging, which belongs to the field of electronic electrical appliances. Background technique [0002] With the development of science and technology, the application of electronics is becoming more and more widely used, but its application environment is complicated, especially the development of electronic appliances is integrated, miniaturized, and modular development. Therefore, it has put forward higher requirements for its use stability.Factors affecting electronic electronics stability are mainly device moisture, dust pollution, invasion of corrosive substances, mechanical vibrations, external force damage, etc., and there is a problem of calorie transmission for devices with greater power.Therefore, technical measures need to be used to ensure the stability of the performance parameters of electronics, where polymer packaging is a common method.The packaging is the opera...

Claims

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Application Information

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IPC IPC(8): C08L83/06C08L83/07C08L83/05C08K3/36C08K5/5419
CPCC08L83/06C08L2201/10C08L2205/035C08L83/04C08K3/36C08K5/5419
Inventor 刘爱华
Owner 江苏矽时代材料科技有限公司
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