Ceramic substrate circuit board and manufacturing method thereof

A technology of ceramic substrate and manufacturing method, which is applied in the direction of printed circuit manufacturing, printed circuit, circuit substrate materials, etc., can solve problems affecting the processing technology of ceramic substrates, affecting the overall performance of ceramic substrate circuit boards, uneven or skewed aluminum sheets, etc. Achieve the effects of prolonging service life, reducing thickness, improving oxidation resistance and wear resistance

Active Publication Date: 2016-02-17
平湖威格博尔电器有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The process of welding aluminum sheets by soldering in the prior art, due to the surface tension of the solder, the welded aluminum sheets are prone to unevenness or skewing, which affects the subsequent processing technology of the ceramic substrate and the overall performance of the ceramic substrate circuit board.

Method used

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  • Ceramic substrate circuit board and manufacturing method thereof
  • Ceramic substrate circuit board and manufacturing method thereof
  • Ceramic substrate circuit board and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] This embodiment provides a ceramic substrate circuit board, including a ceramic substrate, a palladium-silver pad embedded on the ceramic substrate through a sintering process, and an anti-oxidation layer, and the anti-oxidation layer is attached to the palladium-silver pad through an electroplating process away from the outer surface of the ceramic substrate. Those skilled in the art can understand that the anti-oxidation layer is attached to the palladium-silver pad through the electroplating process, and the structure of the anti-oxidation layer is more smooth and stable, which can effectively improve the overall performance of the ceramic substrate circuit board. In addition, compared with the soldering technology in the prior art, since the solder layer is omitted between the anti-oxidation layer and the palladium-silver pad, the thickness of the ceramic substrate circuit board can be effectively reduced, and the electronic circuit board manufactured by using the ci...

Embodiment 2

[0018] Such as figure 1 As shown, the present embodiment provides a method for manufacturing a ceramic substrate circuit board 2, comprising the following steps:

[0019] Step 1, embedding the palladium-silver paste on the ceramic substrate through a sintering process to form a palladium-silver pad;

[0020] Step 2. Attach the anti-oxidation material to the surface of the palladium-silver pad far away from the ceramic substrate through an electroplating process to form an anti-oxidation layer.

[0021] Those skilled in the art can understand that the anti-oxidation layer is attached to the palladium-silver pad through the electroplating process, and the structure of the anti-oxidation layer is more smooth and stable, which can effectively improve the overall performance of the ceramic substrate circuit board 2 . In addition, compared with the solder soldering technology in the prior art, since the solder layer is omitted between the anti-oxidation layer and the palladium-silv...

Embodiment 3

[0029] Such as figure 2 As shown, the present embodiment provides a method for manufacturing a ceramic substrate circuit board 2, comprising the following steps:

[0030] Step 1, embedding the palladium-silver paste on the ceramic substrate through a sintering process to form a palladium-silver pad;

[0031] Step 2. Attach the anti-oxidation material to the surface of the palladium-silver pad far away from the ceramic substrate through an electroplating process to form an anti-oxidation layer.

[0032] Those skilled in the art can understand that the anti-oxidation layer is attached to the palladium-silver pad through the electroplating process, and the structure of the anti-oxidation layer is more smooth and stable, which can effectively improve the overall performance of the ceramic substrate circuit board 2 . In addition, compared with the solder soldering technology in the prior art, since the solder layer is omitted between the anti-oxidation layer and the palladium-sil...

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PUM

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Abstract

The invention discloses a ceramic substrate circuit board and a manufacturing method thereof. The manufacturing method comprises the following steps: step one, embedding palladium-silver slurry in a ceramic substrate through a sintering process to form a palladium-silver pad; and step two, attaching an antioxidation material on the surface, which is away from the ceramic substrate, of the palladium-silver pad to form an antioxidation layer through an electroplating technology. The ceramic substrate circuit board and the manufacturing method thereof, provided by the invention, can effectively improve the antioxidation performance and the wear resistance of the ceramic substrate circuit board and prolong the service life of the ceramic substrate circuit board; the antioxidation layer is attached to the palladium-silver pad through the electroplating technology so that the structure of the antioxidation layer is more flat and stable, and the overall performance of the ceramic substrate circuit board can be effectively improved; and since a solder tin layer is omitted from between the antioxidation layer and the palladium-silver pad, the thickness of the ceramic substrate circuit board can be effectively reduced, and more design space is provided for electronic products manufactured by use of the circuit board.

Description

technical field [0001] The invention relates to the field of electronic circuits, in particular to a ceramic substrate circuit board and a manufacturing method thereof. Background technique [0002] Ceramic substrate circuit board refers to a special process board in which copper foil is directly bonded to the surface of an alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate (single or double-sided) at high temperature. The made ultra-thin composite substrate has excellent electrical insulation properties, excellent solderability and high adhesion strength, and can etch various patterns like a PCB board, and has a large current-carrying capacity. Ceramic substrates The circuit board also has high thermal conductivity, which can effectively dissipate the heat generated by high thermal electronic components, thereby increasing the stability of the components and prolonging the service life. Basic materials are widely used in high-voltage, high-insulation, high-frequen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03H05K3/28
CPCH05K1/0306H05K3/288H05K2203/0723
Inventor 曹国平肖青荣李德兵
Owner 平湖威格博尔电器有限公司
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