High-elasticity epoxy resin encapsulating material and preparation method thereof

A technology of epoxy resin and potting materials, which is applied in the field of potting materials, can solve problems such as complex preparation process conditions, high manufacturing costs, and insufficient elasticity, and achieve the effects of simple preparation methods, improved mechanical properties, and improved elasticity

Inactive Publication Date: 2016-02-17
SUZHOU GAIDE FINE MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The cost of epoxy resin is relatively low, the molding process is simple, it is suitable for large-scale production, and its reliability is high. Therefore, it has developed rapidly in the past ten years. Compared with foreign countries, the performance of epoxy potting materials for many internal electronics is in many places. There are still deficiencies, such as: insufficient elasticity, certain internal stress during curing, easy to crack, etc.
The epoxy resin adhesive prepared by this invention has the characteristics of good elasticity of the adhesive layer after curing, good bonding strength, and resistance to cold and heat shocks, but its preparation process conditions are relatively complicated and the manufacturing cost is high.

Method used

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  • High-elasticity epoxy resin encapsulating material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] A high elasticity epoxy resin potting material, in parts by weight, comprises the following components:

[0036] 30 parts of epoxy resin, 2 parts of polypropylene fiber,

[0037] 10 parts of polymethyl methacrylate,

[0038] 5 parts of carboxyl-terminated polybutadiene-acrylonitrile,

[0039] 1 part of precipitated silica, 5 parts of active diluent,

[0040] 1 part of crosslinking agent, 3 parts of curing agent.

[0041] Its preparation method comprises the following steps:

[0042] (1) Add epoxy resin, polymethyl methacrylate and carboxyl-terminated polybutadiene-acrylonitrile into a high-speed kneader, and knead at 40-50°C for 30 minutes to obtain a mixture 1;

[0043] (2) Mix and stir the precipitated silica, polypropylene fiber, reactive diluent and crosslinking agent evenly, and ultrasonically stir for 1 hour at a power of 500W to obtain a uniform dispersion;

[0044] (3) Mix the mixed material 1 obtained in step (1) with the uniform dispersion and curing agen...

Embodiment 2

[0046] A high elasticity epoxy resin potting material, in parts by weight, comprises the following components:

[0047] 60 parts of epoxy resin, 5 parts of polypropylene fiber,

[0048] 15 parts of polymethyl methacrylate,

[0049] 10 parts of carboxyl-terminated polybutadiene-acrylonitrile,

[0050] 3 parts of precipitated silica, 12 parts of active diluent,

[0051] 5 parts of crosslinking agent, 7 parts of curing agent.

[0052] Its preparation method comprises the following steps:

[0053] (1) Add epoxy resin, polymethyl methacrylate and carboxyl-terminated polybutadiene-acrylonitrile into a high-speed kneader, and knead at 40-50°C for 60 minutes to obtain a mixture 1;

[0054] (2) Mix and stir the precipitated silica, polypropylene fiber, reactive diluent and crosslinking agent evenly, and ultrasonically stir for 2 hours at a power of 800W to obtain a uniform dispersion;

[0055] (3) Mix the mixed material 1 obtained in step (1) with the uniform dispersion and curing...

Embodiment 3

[0057] A high elasticity epoxy resin potting material, in parts by weight, comprises the following components:

[0058] 40 parts of epoxy resin, 3 parts of polypropylene fiber,

[0059] 11 parts of polymethyl methacrylate,

[0060] 6 parts of carboxyl-terminated polybutadiene-acrylonitrile,

[0061] 1.5 parts of precipitated silica, 7 parts of reactive diluent,

[0062] 2 parts of crosslinking agent, 4 parts of curing agent.

[0063] Its preparation method comprises the following steps:

[0064] (1) Add epoxy resin, polymethyl methacrylate and carboxyl-terminated polybutadiene-acrylonitrile into a high-speed kneader, and knead at 40-50°C for 40 minutes to obtain a mixture 1;

[0065] (2) Mix and stir the precipitated silica, polypropylene fiber, reactive diluent and crosslinking agent evenly, and ultrasonically stir for 1.2h under the power of 600W to obtain a uniform dispersion;

[0066] (3) Mix the mixed material 1 obtained in step (1) with the uniform dispersion and cu...

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Abstract

The invention discloses a high-elasticity epoxy resin encapsulating material. The high-elasticity epoxy resin encapsulating material comprises components in parts by weight as follows: 30-60 parts of epoxy resin, 2-5 parts of polypropylene fiber, 10-15 parts of polymethyl methacrylate, 5-10 parts of carboxyl terminated polybutadiene-acrylonitrile, 1-3 parts of precipitated silica, 5-12 parts of a reactive diluent, 1-5 parts of a cross-linking agent and 3-7 parts of a curing agent. The invention further discloses a preparation method of the high-elasticity epoxy resin encapsulating material. The high-elasticity epoxy resin encapsulating material has good elasticity, good insulation and heat resistance, excellent corrosion resistance and good impact resistance; added compound elastic particles are non-toxic, have a large specific surface area and can effectively improve the mechanical properties of materials; a preparation method is simple, conditions are easy to control, no toxic substances are released in the preparation process, and environmental protection is facilitated.

Description

Technical field: [0001] The invention relates to the technical field of potting materials, in particular to a highly elastic epoxy resin potting material. Background technique: [0002] With the development of the electronics industry, the high performance of electronic devices has put forward higher and higher requirements for potting materials. Currently commonly used potting materials are mainly various synthetic polymers. Epoxy resin, silicone, silicone epoxy, polyimide, liquid crystal polymer, hydroxyl-terminated polybutadiene, various polyurethanes, etc. Epoxy resin is widely used due to its advantages such as small shrinkage, good insulation and heat resistance, and excellent corrosion resistance. The cost of epoxy resin is relatively low, the molding process is simple, it is suitable for large-scale production, and its reliability is high. Therefore, it has developed rapidly in the past ten years. Compared with foreign countries, the performance of epoxy potting ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L23/12C08L33/12C08L13/00C08K3/34
Inventor 李晓明
Owner SUZHOU GAIDE FINE MATERIALS CO LTD
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