Electroplate liquid and electroplate method for gelatin cyanide-free plated Cu-Sn alloy

An electroplating solution, cu-sn technology, applied in the field of copper-tin electroplating, can solve problems such as restricting the promotion of cyanide-free electroplating copper-tin, poor quality of the plating layer, poor performance of the plating solution, etc., and achieve excellent performance of the plating solution and high brightness , the effect of good coating quality

Inactive Publication Date: 2016-02-10
无锡永发电镀有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing cyanide electroplating Cu-Sn alloy generally has the technical defects of poor performance of the plating solution and low...

Method used

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  • Electroplate liquid and electroplate method for gelatin cyanide-free plated Cu-Sn alloy
  • Electroplate liquid and electroplate method for gelatin cyanide-free plated Cu-Sn alloy
  • Electroplate liquid and electroplate method for gelatin cyanide-free plated Cu-Sn alloy

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] The formulation of the electroplating solution is as follows:

[0031]

[0032]

[0033] Plating process conditions: the pulse width of single pulse square wave current is 0.5ms, the duty cycle is 30%, and the average current density is 1A / dm 2 ; The pH is 8, the temperature is 50°C, and the electroplating time is 50min.

Embodiment 2

[0035] The formulation of the electroplating solution is as follows:

[0036]

[0037] Plating process conditions: the pulse width of single pulse square wave current is 0.6ms, the duty cycle is 25%, and the average current density is 1.2A / dm 2 ; The pH is 8.5, the temperature is 45°C, and the electroplating time is 45min.

Embodiment 3

[0039] The formulation of the electroplating solution is as follows:

[0040]

[0041] Plating process conditions: the pulse width of single pulse square wave current is 0.8ms, the duty cycle is 20%, and the average current density is 2A / dm 2 ; The pH is 9, the temperature is 30° C., and the electroplating time is 40 minutes.

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PUM

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Abstract

The invention discloses electroplate liquid and an electroplate method for gelatin cyanide-free plated Cu-Sn alloy. The electroplate liquid is composed of 8-12 g/L of copper pyrophosphate in terms of copper, 34-46 g/L of stannous pyrophosphate in terms of tin, 135-155 g/L of alkali metal pyrophosphate in terms of pyrophosphate radicals, 0.1-0.3 g/L of gelatin and 2-8 g/L of heliotropin. According to the electroplate liquid, the copper pyrophosphate serves as main copper salt, the stannous pyrophosphate serves as main tin salt, the alkali metal pyrophosphate serves as coordination agents, the gelatin serves as brightening agents, and the heliotropin serves as auxiliary brightening agents, so that the obtained electroplate liquid is good in dispersion capacity and covering capacity, cathode currents are high in efficiency, and the electroplate liquid is excellent in performance. By the adoption of the electroplate liquid, plating obtained through electroplating under the alkaline condition is low in porosity, high in brightness and good in quality.

Description

technical field [0001] The invention relates to the technical field of electroplating copper and tin, in particular to an electroplating solution and an electroplating method for cyanide-free plating of Cu-Sn alloys on gelatin. Background technique [0002] Electroplating copper-tin alloy is one of the earliest alloy plating types. Due to the shortage of nickel resources and other reasons, the price of nickel continues to increase, and the nickel substitute plating has attracted more and more attention. Copper-tin alloy is used as a nickel substitute for protective and decorative coatings, which can not only meet the application requirements, but also reduce the use of nickel, so it has a very high market value. In the late 1980s, studies found that metal nickel contact with human skin can cause nickel sensitivity symptoms. Therefore, in many countries, such as the European Community countries, legislation has been established in the 1990s to limit the amount of nickel in j...

Claims

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Application Information

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IPC IPC(8): C25D3/58C25D3/60C25D5/18
Inventor 石明
Owner 无锡永发电镀有限公司
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