Insulating and heat-conductive sheet

Abstract

The present invention addresses the problem of providing a heat-conductive sheet having excellent insulation properties and thermal anisotropy and also having high heat-dissipating properties. An insulating and heat-conductive sheet characterized by comprising insulating and highly heat-conductive fibers that penetrate in the thickness direction and a binder resin, wherein the penetration density of the insulating and highly heat-conductive fibers that penetrate in the thickness direction is 6% or more, the ratio of the thermal resistivity in the thickness direction to the thermal resistivity in the planar direction is 2 or more, and the initial dielectric breakdown strength is 20 kV / mm or more.

Description

technical field [0001] The present invention relates to an insulating heat conducting sheet having electrical insulation and high thermal anisotropy. More specifically, it relates to an insulating heat conduction sheet capable of ensuring insulation reliability and selectively transferring heat in a specific direction from heat radiators such as electronic substrates, semiconductor chips, and light sources. Background technique [0002] In recent years, the importance of heat dissipation measures has increased as electronic equipment has become lighter, thinner and smaller, and the heat dissipation density has increased due to higher power consumption. In order to reduce the thermal failure of electronic equipment, it is important to quickly release the heat generated in the equipment to heat radiators such as cooling materials and housings in a manner that does not adversely affect peripheral components. member. As a method of dissipating heat generated from radiators suc...

AI Technical Summary

Problems solved by technology

However, thermal conduction is suppressed due to the matrix resin layer existing between fillers, and high thermal anisotropy cannot be obtained in terms of filling ratio

[0006] In addition, in general, fibrous heat-conducting materials obtain high thermal conductivity by increasing the orientation of molecules along the fiber axis direction. When there are many polymers that can obtain such an orientation, they do not have highly rigid molecular chains and are incompatible with Functional groups for interaction with other substances, lack of wettability with binder resin

Therefore, in the actual use environment, due to exposure to high temperature and repeated temperature changes, the interface between the thermally conductive material and the binder resin may peel off, and the dielectric breakdown strength may decrease.

Images